Inventor · disambiguated record
Noriyuki Kirikae
Also filed as: KIRIKAE NORIYUKI
12 granted patents·5 pending applications·27 citations·filing 2001–2019
86Inventor score
Top patents by PatentIndex Score
17 records- 0184US10689550B2Electrically conductive compositionFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Jun 23, 2020·5 cites·13 claims
- 0283US11139261B2Film-like adhesive and method for producing semiconductor package using film-like adhesiveFURUKAWA ELECTRIC CO LTD·Filed 2019·Granted Oct 5, 2021·4 cites·2 claims
- 0381US10563096B2Conductive adhesive compositionFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Feb 18, 2020·1 cites·16 claims
- 0466US11066577B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jul 20, 2021·1 cites·13 claims
- 0564US11230649B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jan 25, 2022·1 cites·12 claims
- 0663US6716674B2Method of forming a semiconductor packageTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 6, 2004·10 cites·19 claims
- 0752US9101062B2Highly heat conductive polyimide film, highly heat conductive metal-clad laminate, and method for producing the sameAOYAGI EIJIRO·Filed 2009·Granted Aug 4, 2015·2 cites·4 claims
- 0849US2018294242A1Electrically conductive adhesive film and dicing die bonding filmFURUKAWA ELECTRIC CO LTD·Filed 2018·Application pending·0 cites
- 0946US10115707B2Adhesive film and semiconductor package using adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Oct 30, 2018·0 cites·13 claims
- 1046US6774496B2Semiconductor package with a thermoset bondTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 10, 2004·2 cites·16 claims
- 1145US2017152405A1Adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
- 1244US2018026003A1Electrically conductive adhesive film and dicing die bonding filmFURUKAWA ELECTRIC CO LTD·Filed 2016·Application pending·0 cites
- 1343US11136479B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Oct 5, 2021·0 cites·11 claims
- 1443US6969919B2Semiconductor package production method and semiconductor packageTEXAS INSTRUMENTS INC·Filed 2004·Granted Nov 29, 2005·1 cites·13 claims
- 1541US11193047B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Dec 7, 2021·0 cites·11 claims
- 1635US2017152418A1Maleimide filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
- 1734US2017152411A1Conductive adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →