Inventor · disambiguated record
Nobuya Koike
Also filed as: KOIKE NOBUYA
31 granted patents·6 pending applications·451 citations·filing 1994–2024
97Inventor score
Technology areasH10W
Files withRENESAS ELECTRONICS CORP15HITACHI LTD8KOIKE NOBUYA3NAKAMURA HIROYUKI3FUJI ELECTRIC CO LTD2
Top patents by PatentIndex Score
37 records- 0191US8367479B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 5, 2013·13 cites·10 claims
- 0289US10031164B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 24, 2018·6 cites·13 claims
- 0389US6434008B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·84 cites·11 claims
- 0489US5956231ASemiconductor device having power semiconductor elementsHITACHI LTD·Filed 1995·Granted Sep 21, 1999·85 cites·20 claims
- 0587US9704979B2Semiconductor device and an electronic deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 11, 2017·9 cites·20 claims
- 0686US9024423B2Semiconductor device for a DC-DC converterMUTO AKIRA·Filed 2010·Granted May 5, 2015·10 cites·23 claims
- 0786US8114710B2Manufacturing method of resin-sealed semiconductor deviceMUTO AKIRA·Filed 2009·Granted Feb 14, 2012·16 cites·3 claims
- 0885US8299599B2Semiconductor deviceNAKAMURA HIROYUKI·Filed 2011·Granted Oct 30, 2012·8 cites·22 claims
- 0983US8232629B2Semiconductor deviceKOIKE NOBUYA·Filed 2007·Granted Jul 31, 2012·12 cites·15 claims
- 1083US5621243ASemiconductor device having thermal stress resistance structureHITACHI LTD·Filed 1994·Granted Apr 15, 1997·80 cites·32 claims
- 1181US7462887B2Semiconductor connection componentRENESAS TECH CORP·Filed 2006·Granted Dec 9, 2008·8 cites·7 claims
- 1279US8362626B2Semiconductor device with non-overlapped circuitsRENESAS ELECTRONICS CORP·Filed 2008·Granted Jan 29, 2013·9 cites·16 claims
- 1378US8994159B2Semiconductor device and manufacturing method thereofNAKAMURA HIROYUKI·Filed 2013·Granted Mar 31, 2015·4 cites·28 claims
- 1478US5808359ASemiconductor device having a heat sink with bumpers for protecting outer leadsHITACHI LTD·Filed 1995·Granted Sep 15, 1998·40 cites·6 claims
- 1577US9129979B2Semiconductor deviceKOIKE NOBUYA·Filed 2012·Granted Sep 8, 2015·4 cites·17 claims
- 1677US8975733B2Semiconductor device and a manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 10, 2015·3 cites·24 claims
- 1774US9997620B2Semiconductor device and an electronic deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jun 12, 2018·2 cites·16 claims
- 1873US8338927B2Semiconductor device with the leads projected from sealing bodyNAKAMURA HIROYUKI·Filed 2011·Granted Dec 25, 2012·3 cites·20 claims
- 1971US6492739B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2002·Granted Dec 10, 2002·12 cites·7 claims
- 2069US7141741B2Circuit boardHITACHI HARAMACHI ELECTRONICS·Filed 2003·Granted Nov 28, 2006·12 cites·1 claims
- 2166US7968370B2Semiconductor connection componentRENESAS ELECTRONICS CORP·Filed 2008·Granted Jun 28, 2011·2 cites·7 claims
- 2264US2025096080A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 2362US6320270B1Semiconductor device and method of producing the sameHITACHI LTD·Filed 2000·Granted Nov 20, 2001·7 cites·4 claims
- 2460US6849933B2Semiconductor mounting device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Feb 1, 2005·9 cites·10 claims
- 2556US2024429147A1Semiconductor apparatusFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 2655US6392308B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2001·Granted May 21, 2002·4 cites·6 claims
- 2753US10453946B2Semiconductor device and an electronic deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 22, 2019·0 cites·10 claims
- 2853US8026130B2Method for manufacturing a semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 27, 2011·0 cites·20 claims
- 2952US9396971B2Semiconductor device and a manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 19, 2016·0 cites·1 claims
- 3052US9230831B2Semiconductor device and a manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 5, 2016·0 cites·4 claims
- 3151US2018306844A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3249US8564112B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Oct 22, 2013·0 cites·11 claims
- 3348US8298859B2Semiconductor connection componentKOIKE NOBUYA·Filed 2011·Granted Oct 30, 2012·0 cites·4 claims
- 3446US6104085ASemiconductor device and method of producing the sameHITACHI LTD·Filed 1999·Granted Aug 15, 2000·9 cites·11 claims
- 3539US2018277518A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3639US2003016502A1Semiconductor deviceFiled 2002·Application pending·0 cites
- 3732US2016093561A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →