Inventor · disambiguated record
Nozomi Matsubara
Also filed as: MATSUBARA NOZOMI
2 granted patents·12 pending applications·0 citations·filing 2018–2023
22Inventor score
Top patents by PatentIndex Score
14 records- 0169US2023016868A1Curable composition set and articleSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 0268US2022403082A1Composition set containing compound having polyoxyalkylene chainSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 0361US2025282116A1Sheet comprising thermal insulation layer and adhesive layerRESONAC CORP·Filed 2023·Application pending·0 cites
- 0460US2024132646A1Composition containing (meth)acrylamide compound and compound having polyoxyalkylene chainRESONAC CORP·Filed 2022·Application pending·0 cites
- 0560US2024132645A1Composition containing compound having polyoxyalkylene chain and compound having poly(meth)acrylate chainSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 0659US2024043648A1Composition and sheet containing cured product of sameRESONAC CORP·Filed 2021·Application pending·0 cites
- 0759US2024043597A1Composition and sheetRESONAC CORP·Filed 2021·Application pending·0 cites
- 0854US2025282980A1Sheet provided with heat insulating layer and adhesive layerRESONAC CORP·Filed 2023·Application pending·0 cites
- 0950US11965048B2Acrylic resin, producing method thereof, resin composition set, heat storage material, and articleSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Apr 23, 2024·0 cites·5 claims
- 1050US11352466B2Resin composition, heat storage material, and commodityHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 7, 2022·0 cites·14 claims
- 1149US2024047230A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1248US2021024803A1Resin member, method for producing resin member and heat storage bodyHITACHI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
- 1343US2021261706A1Resin composition, heat storage material, and articleSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 1443US2021246349A1Resin composition, heat storage material, and articleSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →