Inventor · disambiguated record
Norliza Morban
Also filed as: MORBAN NORLIZA
7 granted patents·2 pending applications·6 citations·filing 2014–2025
74Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG9
Top patents by PatentIndex Score
9 records- 0176US10741466B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 11, 2020·3 cites·7 claims
- 0275US11296000B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 5, 2022·1 cites·7 claims
- 0364US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0459US12300559B2Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·15 claims
- 0557US9252089B2Universal lead frame for flat no-leads packagesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 2, 2016·2 cites·18 claims
- 0655US12021000B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jun 25, 2024·0 cites·10 claims
- 0752US12176222B2Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 0844US2023170329A1Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0941US11152288B2Lead frames for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 19, 2021·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →