Inventor · disambiguated record
Nobuyuki Morimoto
Also filed as: MORIMOTO NOBUYUKI
27 granted patents·7 pending applications·129 citations·filing 1984–2010
95Inventor score
Files withSUMCO CORP27RES ASS PETROLEUM ALTERNAT DEV3AKIYOSHI KAZUNARI1MATSUSHITA SEIKO KK1MORIMOTO NOBUYUKI1
Top patents by PatentIndex Score
34 records- 0194US4578259AProcess for preparing a crystalline aluminosilicateRES ASS PETROLEUM ALTERNAT DEV·Filed 1984·Granted Mar 25, 1986·42 cites·1 claims
- 0278US4695440ACrystalline aluminosilicate ISI-6RES ASS PETROLEUM ALTERNAT DEV·Filed 1986·Granted Sep 22, 1987·11 cites·3 claims
- 0375US8987230B2Hybrid gel comprising chemically crosslinked hyaluronic acid derivative and pharmaceutical composition comprising the sameAKIYOSHI KAZUNARI·Filed 2008·Granted Mar 24, 2015·1 cites·17 claims
- 0474US7858494B2Laminated substrate manufacturing method and laminated substrate manufactured by the methodSUMCO CORP·Filed 2006·Granted Dec 28, 2010·6 cites·4 claims
- 0574US7851337B2Method for producing semiconductor substrateSUMCO CORP·Filed 2007·Granted Dec 14, 2010·5 cites·3 claims
- 0668US7507641B2Method of producing bonded waferSUMCO CORP·Filed 2007·Granted Mar 24, 2009·4 cites·3 claims
- 0767US8048767B2Bonded wafer and method for producing bonded waferSUMCO CORP·Filed 2007·Granted Nov 1, 2011·2 cites·5 claims
- 0867US7951692B2Method of producing semiconductor substrate having an SOI structureSUMCO CORP·Filed 2008·Granted May 31, 2011·3 cites·2 claims
- 0967US7494899B2Method for manufacturing semiconductor substrateSUMCO CORP·Filed 2005·Granted Feb 24, 2009·4 cites·3 claims
- 1066US7855132B2Method of manufacturing bonded waferSUMCO CORP·Filed 2008·Granted Dec 21, 2010·2 cites·9 claims
- 1163US7795117B2Method of producing semiconductor substrate having an SOI structureSUMCO CORP·Filed 2007·Granted Sep 14, 2010·2 cites·9 claims
- 1260US6401709B1Range hoodMATSUSHITA SEIKO KK·Filed 2001·Granted Jun 11, 2002·12 cites·24 claims
- 1358US7534728B2Process for cleaning silicon substrateSUMCO CORP·Filed 2006·Granted May 19, 2009·1 cites·6 claims
- 1458US7446016B2Method for producing bonded waferSUMCO CORP·Filed 2004·Granted Nov 4, 2008·8 cites·5 claims
- 1557US8003494B2Method for producing a bonded waferSUMCO CORP·Filed 2008·Granted Aug 23, 2011·1 cites·2 claims
- 1656US7510948B2Method for producing SOI waferSUMCO CORP·Filed 2004·Granted Mar 31, 2009·7 cites·5 claims
- 1754US7713838B2SOI wafer and its manufacturing methodSUMCO CORP·Filed 2004·Granted May 11, 2010·4 cites·1 claims
- 1854US7563697B2Method for producing SOI waferSUMCO CORP·Filed 2004·Granted Jul 21, 2009·6 cites·5 claims
- 1953US7358147B2Process for producing SOI waferSUMCO CORP·Filed 2004·Granted Apr 15, 2008·4 cites·4 claims
- 2052US7544583B2SOI wafer and its manufacturing methodSUMCO CORP·Filed 2004·Granted Jun 9, 2009·3 cites·9 claims
- 2151US2009023272A1Method of producing bonded waferSUMCO CORP·Filed 2008·Application pending·0 cites
- 2249US2010178750A1Method for producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 2349US2007298589A1Method of producing bonded waferSUMCO CORP·Filed 2007·Application pending·0 cites
- 2448US8183133B2Method for producing semiconductor substrateMURAKAMI SATOSHI·Filed 2010·Granted May 22, 2012·0 cites·4 claims
- 2547US7927957B2Method for producing bonded silicon waferSUMCO CORP·Filed 2009·Granted Apr 19, 2011·0 cites·8 claims
- 2647US2009186464A1Method for producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 2746US8048769B2Method for producing bonded waferSUMCO CORP·Filed 2007·Granted Nov 1, 2011·0 cites·16 claims
- 2845US7902043B2Method of producing bonded waferSUMCO CORP·Filed 2007·Granted Mar 8, 2011·0 cites·8 claims
- 2945US7799655B2Method for evaluation of bonded waferSUMCO CORP·Filed 2008·Granted Sep 21, 2010·0 cites·4 claims
- 3044US2009117708A1Method for manufacturing soi substrateSUMCO CORP·Filed 2007·Application pending·0 cites
- 3144US2008061452A1Bonded wafer and method of manufacturing the sameSUMCO CORP·Filed 2007·Application pending·0 cites
- 3243US8802540B2Method of manufacturing bonded waferMORIMOTO NOBUYUKI·Filed 2007·Granted Aug 12, 2014·0 cites·9 claims
- 3343US2007184631A1Method of manufacturing bonded waferSUMCO CORP·Filed 2006·Application pending·0 cites
- 3430US4766263AHydrocarbon synthesis process utilizing crystalline aluminosilicate catalystRES ASS PETROLEUM ALTERNAT DEV·Filed 1987·Granted Aug 23, 1988·1 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →