Inventor · disambiguated record
Noriaki Mukai
Also filed as: MUKAI NORIAKI
10 granted patents·3 pending applications·192 citations·filing 1986–2013
89Inventor score
Top patents by PatentIndex Score
13 records- 0196US6237484B1Screen printing apparatusHITACHI TECHNO ENG·Filed 1998·Granted May 29, 2001·54 cites·11 claims
- 0295US4981074AMethod and apparatus for screen printingHITACHI TECHNO ENG·Filed 1989·Granted Jan 1, 1991·76 cites·24 claims
- 0379US8038050B2Solder ball printing apparatusHITACHI PLANT TECHNOLOGIES LTD·Filed 2010·Granted Oct 18, 2011·6 cites·17 claims
- 0479US5176076AScreen printerHITACHI TECHNO ENG·Filed 1991·Granted Jan 5, 1993·26 cites·13 claims
- 0570US8302838B2Micro-bump forming apparatusMUKAI NORIAKI·Filed 2011·Granted Nov 6, 2012·4 cites·11 claims
- 0663US7896223B2Solder ball printing apparatusHITACHI PLANT TECHNOLOGIES LTD·Filed 2009·Granted Mar 1, 2011·3 cites·6 claims
- 0755US4776105AApparatus for fixing electronic parts to printed circuit boardHITACHI TECHNO ENG·Filed 1986·Granted Oct 11, 1988·13 cites·9 claims
- 0851US8651356B2Solder bump forming apparatus and soldering facility including the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted Feb 18, 2014·0 cites·15 claims
- 0947US4809443AApparatus for fixing electronic parts to printed circuit boardHITACHI TECHNO ENG·Filed 1986·Granted Mar 7, 1989·10 cites·6 claims
- 1044US2013134207A1Solder bump forming apparatus and soldering facility including the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1141US2010272884A1Solder ball printing apparatus and solder ball printing methodHITACHI PLANT TECHNOLOGIES LTD·Filed 2010·Application pending·0 cites
- 1239US2014103098A1Mask for bumping solder balls on circuit board and solder ball bumping method using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1336US8921157B2Printed substrate manufacturing equipment and manufacturing methodMUKAI NORIAKI·Filed 2012·Granted Dec 30, 2014·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →