Inventor · disambiguated record
Nobuyuki Ogawa
Also filed as: OGAWA NOBUYUKI
25 granted patents·6 pending applications·376 citations·filing 1991–2022
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD10HITACHI CHEMICAL CO LTD7MITSUBISHI ELECTRIC CORP4FUJIMOTO DAISUKE2TANAKA KENJI2
Top patents by PatentIndex Score
31 records- 0192US5525062ATraining apparatus for singingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jun 11, 1996·61 cites·15 claims
- 0289US5879568AProcess for producing multilayer printed circuit board for wire bondingHITACHI LTD·Filed 1997·Granted Mar 9, 1999·126 cites·8 claims
- 0387US5906494ATraining apparatus for singingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted May 25, 1999·74 cites·18 claims
- 0480US7740936B2Adhesion assisting agent fitted metal foil, and printed wiring board using thereofHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 22, 2010·11 cites·24 claims
- 0576US11432400B2Interlayer insulating film and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 30, 2022·2 cites·19 claims
- 0676US10513604B2Binder resin composition, electrode for lithium ion secondary battery and lithium ion secondary batteryHITACHI CHEMICAL CO LTD·Filed 2016·Granted Dec 24, 2019·1 cites·7 claims
- 0774US5447438AMusic training apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Sep 5, 1995·29 cites·14 claims
- 0864US10645804B2Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring boardMATSUURA MASAHARU·Filed 2012·Granted May 5, 2020·2 cites·12 claims
- 0960US2012315438A1Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetTANAKA KENJI·Filed 2012·Application pending·0 cites
- 1059US2025087970A1Semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1158US2025038474A1Optical semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1257US11482706B2Resin for energy device electrode, composition for forming energy device electrode, energy device electrode, and energy deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·11 claims
- 1356US11287313B2Detecting compositions and method of using sameSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Mar 29, 2022·0 cites·16 claims
- 1456US7648770B2Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jan 19, 2010·4 cites·11 claims
- 1556US6153359AProcess for producing multilayer printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1999·Granted Nov 28, 2000·19 cites·11 claims
- 1654US5303061AApparatus for rejecting time base error of video signalMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Apr 12, 1994·15 cites·16 claims
- 1748US8507100B2Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetTANAKA KENJI·Filed 2010·Granted Aug 13, 2013·0 cites·12 claims
- 1846US11929590B2Method for producing optical semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 12, 2024·0 cites·10 claims
- 1943US12431532B2Electrolyte composition, secondary cell, and method for manufacturing electrolyte sheetLG ENERGY SOLUTION LTD·Filed 2018·Granted Sep 30, 2025·0 cites·10 claims
- 2042US5945258AProcess for producing multilayer printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1996·Granted Aug 31, 1999·10 cites·5 claims
- 2141US2014151091A1Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for sameFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 2239US2006237747A1Heterojunction bipolar transistor and amplifier including the sameMITSUBISHI ELECTRIC CORP·Filed 2006·Application pending·0 cites
- 2338US8636858B2Production equipment and production method for precipitation hardened alloy stripTAKEDA MAHOTO·Filed 2010·Granted Jan 28, 2014·0 cites·4 claims
- 2437US2012305291A1Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereofFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 2535US5220411ASynchronizing phase shift corrected synchronous signal detecting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Jun 15, 1993·4 cites·4 claims
- 2633US5400410ASignal separatorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Mar 21, 1995·4 cites·9 claims
- 2733US5251014ACircuit for detecting phase error of color burst signalMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Oct 5, 1993·3 cites·4 claims
- 2832US6738613B1Telephone set having automatic incoming-call acknowledgement detectionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 18, 2004·8 cites·21 claims
- 2932US5283660AVideo signal processing apparatus having timebase corrector and means for replacing residual error data with specific dataMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Feb 1, 1994·2 cites·4 claims
- 3031US5229892ATime base corrector having a velocity error data extracting circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Jul 20, 1993·1 cites·4 claims
- 3130US7664375B2Information signal edition apparatus, information signal edition method, and information edition programPANASONIC CORP·Filed 2002·Granted Feb 16, 2010·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →