Inventor · disambiguated record
Noboru Okane
Also filed as: OKANE NOBORU
2 granted patents·3 pending applications·5 citations·filing 2006–2009
45Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0166US7569921B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2006·Granted Aug 4, 2009·5 cites·19 claims
- 0247US8231046B2Wire bonding apparatus and wire bonding methodNAKAO MITSUHIRO·Filed 2009·Granted Jul 31, 2012·0 cites·4 claims
- 0346US2008099532A1Wire bonding apparatus and wire bonding methodTOSHIBA KK·Filed 2007·Application pending·0 cites
- 0439US2007023875A1Semiconductor package and manufacturing method thereofTOSHIBA KK·Filed 2006·Application pending·0 cites
- 0538US2007023922A1Semiconductor packageTOSHIBA KK·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →