Inventor · disambiguated record
Nobuyuki Okuzawa
Also filed as: OKUZAWA NOBUYUKI
26 granted patents·13 pending applications·514 citations·filing 2004–2024
96Inventor score
Top patents by PatentIndex Score
39 records- 0198US7863095B2Method of manufacturing layered chip packageHEADWAY TECHNOLOGIES INC·Filed 2010·Granted Jan 4, 2011·233 cites·12 claims
- 0295US8050045B2Electronic component and method of manufacturing the sameTDK CORP·Filed 2006·Granted Nov 1, 2011·42 cites·12 claims
- 0393US7557439B1Layered chip package that implements memory deviceTDK CORP·Filed 2008·Granted Jul 7, 2009·31 cites·12 claims
- 0491US7767494B2Method of manufacturing layered chip packageHEADWAY TECHNOLOGIES INC·Filed 2008·Granted Aug 3, 2010·24 cites·10 claims
- 0591US7745259B2Layered chip package and method of manufacturing sameHEADWAY TECHNOLOGIES INC·Filed 2008·Granted Jun 29, 2010·24 cites·6 claims
- 0691US7221250B2Coil component and method of manufacturing the sameTDK CORP·Filed 2005·Granted May 22, 2007·23 cites·7 claims
- 0789US7968374B2Layered chip package with wiring on the side surfacesHEADWAY TECHNOLOGIES INC·Filed 2009·Granted Jun 28, 2011·17 cites·18 claims
- 0887US7145427B2Coil component and method of manufacturing the sameTDK CORP·Filed 2004·Granted Dec 5, 2006·25 cites·10 claims
- 0984US7397334B2Coil component and method of manufacturing the sameTDK CORP·Filed 2005·Granted Jul 8, 2008·14 cites·8 claims
- 1083US8154116B2Layered chip package with heat sinkSASAKI YOSHITAKA·Filed 2008·Granted Apr 10, 2012·11 cites·18 claims
- 1183US7868442B2Layered chip package and method of manufacturing sameHEADWAY TECHNOLOGIES INC·Filed 2008·Granted Jan 11, 2011·10 cites·2 claims
- 1282US7414508B2Common mode choke coil and method of manufacturing the sameTDK CORP·Filed 2006·Granted Aug 19, 2008·12 cites·16 claims
- 1382US7318269B2Method of manufacturing coil componentTDK CORP·Filed 2004·Granted Jan 15, 2008·15 cites·3 claims
- 1481US8134229B2Layered chip packageSASAKI YOSHITAKA·Filed 2010·Granted Mar 13, 2012·5 cites·3 claims
- 1580US7964976B2Layered chip package and method of manufacturing sameHEADWAY TECHNOLOGIES INC·Filed 2008·Granted Jun 21, 2011·8 cites·3 claims
- 1676US7846772B2Layered chip package and method of manufacturing sameHEADWAY TECHNOLOGIES INC·Filed 2008·Granted Dec 7, 2010·6 cites·15 claims
- 1773US8324741B2Layered chip package with wiring on the side surfacesSASAKI YOSHITAKA·Filed 2011·Granted Dec 4, 2012·3 cites·11 claims
- 1872US7905008B2Method of manufacturing a coil componentTDK CORP·Filed 2006·Granted Mar 15, 2011·5 cites·4 claims
- 1966US2025111977A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 2066US2024312696A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 2166US2024312695A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 2266US2025111969A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 2365US11508494B2Dielectric composition and electronic componentTDK CORP·Filed 2020·Granted Nov 22, 2022·0 cites·6 claims
- 2464US2024153696A1Coil component and method of manufacturing coil componentTDK CORP·Filed 2023·Application pending·0 cites
- 2563US12170163B2Coil component and manufacturing method thereforTDK CORP·Filed 2021·Granted Dec 17, 2024·0 cites·11 claims
- 2662US11380482B2Dielectric composition and electronic componentTDK CORP·Filed 2019·Granted Jul 5, 2022·0 cites·14 claims
- 2762US2024312684A1Coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 2859US12293864B2Coil component and manufacturing method thereforTDK CORP·Filed 2021·Granted May 6, 2025·0 cites·6 claims
- 2958US2023307167A1Multilayer coil componentTDK CORP·Filed 2023·Application pending·0 cites
- 3058US2023307164A1Multilayer coil componentTDK CORP·Filed 2023·Application pending·0 cites
- 3158US2023307163A1Multilayer coil component and method for adjusting characteristics of multilayer coil componentTDK CORP·Filed 2023·Application pending·0 cites
- 3257US2023230756A1Laminated coil componentTDK CORP·Filed 2023·Application pending·0 cites
- 3356US12462970B2Coil componentTDK CORP·Filed 2021·Granted Nov 4, 2025·0 cites·10 claims
- 3456US7683269B2Thin film device and method for manufacturing the sameTDK CORP·Filed 2008·Granted Mar 23, 2010·1 cites·7 claims
- 3556US7283028B2Coil componentTDK CORP·Filed 2004·Granted Oct 16, 2007·5 cites·8 claims
- 3656US2023207182A1Multilayer coil componentTDK CORP·Filed 2022·Application pending·0 cites
- 3749US2023230757A1Laminated coil componentTDK CORP·Filed 2023·Application pending·0 cites
- 3847US8513034B2Method of manufacturing layered chip packageSASAKI YOSHITAKA·Filed 2011·Granted Aug 20, 2013·0 cites·10 claims
- 3945US2009244808A1Thin-film capacitorTDK CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →