Inventor · disambiguated record
Noriyuki Oroku
Also filed as: OROKU NORIYUKI
19 granted patents·8 pending applications·547 citations·filing 1990–2009
96Inventor score
Top patents by PatentIndex Score
27 records- 0186US6770547B1Method for producing a semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 3, 2004·40 cites·28 claims
- 0286US6624504B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·43 cites·24 claims
- 0386US6401734B1Substrate treating apparatusHITACHI INT ELECTRIC CO LTD·Filed 2000·Granted Jun 11, 2002·47 cites·19 claims
- 0485US5213176ASelf-propelled vehicleHITACHI LTD·Filed 1990·Granted May 25, 1993·121 cites·10 claims
- 0583US6930388B2Semiconductor device and method for manufacturing the same and semiconductor device-mounted structureRENESAS TECH CORP·Filed 2001·Granted Aug 16, 2005·37 cites·24 claims
- 0683US6822317B1Semiconductor apparatus including insulating layer having a protrusive portionRENESAS TECH CORP·Filed 2000·Granted Nov 23, 2004·37 cites·16 claims
- 0782US8009047B2RFID tagHITACHI LTD·Filed 2008·Granted Aug 30, 2011·11 cites·6 claims
- 0881US7057283B2Semiconductor device and method for producing the sameHITACHI LTD·Filed 2004·Granted Jun 6, 2006·26 cites·30 claims
- 0980US8035522B2RFID tagHITACHI LTD·Filed 2008·Granted Oct 11, 2011·9 cites·17 claims
- 1076US6869008B2Method of forming bumpsHITACHI LTD·Filed 2002·Granted Mar 22, 2005·24 cites·8 claims
- 1176US6595404B2Method of producing electronic part with bumps and method of producing electronic partHITACHI LTD·Filed 2001·Granted Jul 22, 2003·18 cites·3 claims
- 1276US6213386B1Method of forming bumpsHITACHI LTD·Filed 1999·Granted Apr 10, 2001·40 cites·21 claims
- 1375US6695200B2Method of producing electronic part with bumps and method of producing electronic partHITACHI LTD·Filed 2002·Granted Feb 24, 2004·16 cites·12 claims
- 1475US6443168B1Plate-like specimen fluid-treating apparatus and plate-like specimen fluid-treating methodHITACHI INT ELECTRIC INC·Filed 2000·Granted Sep 3, 2002·20 cites·9 claims
- 1573US6402014B1Method of forming bumpsHITACHI LTD·Filed 2000·Granted Jun 11, 2002·18 cites·3 claims
- 1666US7015071B2Method of manufacturing a semiconductor deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2004·Granted Mar 21, 2006·10 cites·13 claims
- 1765US7861938B2RFID thread and sheet-shaped material using itHITACHI LTD·Filed 2008·Granted Jan 4, 2011·2 cites·10 claims
- 1863US6374836B1Apparatus for treating plate type part with fluidHITACHI LTD·Filed 1998·Granted Apr 23, 2002·28 cites·10 claims
- 1948US2007200476A1Display deviceKIJIMA YUUICHI·Filed 2007·Application pending·0 cites
- 2047US2008024051A1Image display deviceTACHIHARA HIROYUKI·Filed 2007·Application pending·0 cites
- 2145US2007114926A1Image display deviceKIJIMA YUUICHI·Filed 2006·Application pending·0 cites
- 2245US2006061256A1Image display device and manufacturing method thereofOROKU NORIYUKI·Filed 2005·Application pending·0 cites
- 2345US2008106183A1Display panelOROKU NORIYUKI·Filed 2005·Application pending·0 cites
- 2444US9063356B2Method for repairing display device and apparatus for sameARAI TAKESHI·Filed 2009·Granted Jun 23, 2015·0 cites·7 claims
- 2544US2006186788A1Image display deviceHITACHI LTD·Filed 2006·Application pending·0 cites
- 2643US2006132035A1Image display apparatus and manufacturing method thereofSAWAI YUICHI·Filed 2005·Application pending·0 cites
- 2741US2006226762A1Image display apparatus and a method for manufacturing thereofSASAMOTO TOSHIO·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Noriyuki Oroku files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →