Inventor · disambiguated record
Nosun Park
Also filed as: PARK NOSUN
15 granted patents·9 pending applications·14 citations·filing 2018–2024
86Inventor score
Top patents by PatentIndex Score
24 records- 0191US10292269B1Inductor with metal-insulator-metal (MIM) capacitorQUALCOMM INC·Filed 2018·Granted May 14, 2019·9 cites·20 claims
- 0289US11515247B2Capacitance fine tuning by fin capacitor designQUALCOMM INC·Filed 2021·Granted Nov 29, 2022·2 cites·20 claims
- 0377US11770115B2Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methodsQUALCOMM INC·Filed 2021·Granted Sep 26, 2023·1 cites·18 claims
- 0477US11658403B2Device, package and/or substrate comprising curved antennaQUALCOMM INC·Filed 2020·Granted May 23, 2023·1 cites·37 claims
- 0567US10693432B2Solenoid structure with conductive pillar technologyQUALCOMM INC·Filed 2018·Granted Jun 23, 2020·1 cites·20 claims
- 0662US12206155B2Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit packageQUALCOMM INC·Filed 2023·Granted Jan 21, 2025·0 cites·30 claims
- 0761US2025349459A1Inductive device for surface mountingQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0860US12040268B2Thin film resistor (TFR) device structure for high performance radio frequency (RF) filter designQUALCOMM INC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 0959US12395152B2Compact hybrid acoustic wave filter structureQUALCOMM INC·Filed 2023·Granted Aug 19, 2025·0 cites·25 claims
- 1056US12354948B2Integrated device and integrated passive device comprising magnetic materialQUALCOMM INC·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 1156US12009292B2Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variationQUALCOMM INC·Filed 2021·Granted Jun 11, 2024·0 cites·18 claims
- 1256US2025022858A1Device comprising stacked through encapsulation via interconnectsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1356US2025037923A1Package comprising a substrate with inductors and a magnetic layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1455US2024387092A1Inductive deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1555US2024304545A1Coupled inductors through substrate-assembly process and/or wafer-level processQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1654US12016247B2Package comprising an integrated passive device configured as a cap for a filterQUALCOMM INC·Filed 2020·Granted Jun 18, 2024·0 cites·22 claims
- 1753US11728293B2Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive componentQUALCOMM INC·Filed 2021·Granted Aug 15, 2023·0 cites·14 claims
- 1852US12402332B2Integrated passive devicesRF360 SINGAPORE PTE LTD·Filed 2021·Granted Aug 26, 2025·0 cites·39 claims
- 1952US2024038439A1Inductor packages employing wire bonds over a lead frame to form integrated inductor(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2051US11502652B2Substrate comprising capacitor configured for power amplifier output matchQUALCOMM INC·Filed 2020·Granted Nov 15, 2022·0 cites·27 claims
- 2151US2023352423A1Die edge protection to eliminate die chippingQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2246US2022248541A1System in package (sip) socket connector interfaceQUALCOMM INC·Filed 2021·Application pending·0 cites
- 2339US10614942B2Inductors formed with through glass viasQUALCOMM INC·Filed 2018·Granted Apr 7, 2020·0 cites·20 claims
- 2437US2020091094A1Integrated filter technology with embedded devicesQUALCOMM INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →