Inventor · disambiguated record
Noriko Shimizu
Also filed as: SHIMIZU NORIKO
13 granted patents·5 pending applications·29 citations·filing 2005–2023
88Inventor score
Top patents by PatentIndex Score
18 records- 0193US10340072B2Electronic component and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2016·Granted Jul 2, 2019·6 cites·6 claims
- 0291US9478354B2Inductor manufacturing methodMURATA MANUFACTURING CO·Filed 2015·Granted Oct 25, 2016·5 cites·3 claims
- 0388US11276519B2Coil componentMURATA MANUFACTURING CO·Filed 2018·Granted Mar 15, 2022·4 cites·20 claims
- 0484US11705271B2Coil componentMURATA MANUFACTURING CO·Filed 2019·Granted Jul 18, 2023·2 cites·20 claims
- 0583US11488760B2Electronic component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2018·Granted Nov 1, 2022·2 cites·13 claims
- 0681US8771456B2Method of manufacturing a semiconductor device and substrate separating apparatusTOSHIBA KK·Filed 2013·Granted Jul 8, 2014·5 cites·19 claims
- 0779US11919084B2Electronic component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2022·Granted Mar 5, 2024·0 cites·3 claims
- 0878US11569022B2Coil componentMURATA MANUFACTURING CO·Filed 2019·Granted Jan 31, 2023·1 cites·20 claims
- 0978US10872720B2Electronic componentMURATA MANUFACTURING CO·Filed 2017·Granted Dec 22, 2020·1 cites·19 claims
- 1076US2023191484A1Coil component and method of manufacturing the coil componentMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1165US8790995B2Processing method and processing device of semiconductor wafer, and semiconductor waferTAKYU SHINYA·Filed 2012·Granted Jul 29, 2014·2 cites·14 claims
- 1263US11615903B2Coil component and method of manufacturing the coil componentMURATA MANUFACTURING CO·Filed 2018·Granted Mar 28, 2023·0 cites·5 claims
- 1362US7294558B2Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquidTOSHIBA KK·Filed 2005·Granted Nov 13, 2007·1 cites·16 claims
- 1454US2022362073A1Accommodation body for absorbent articleUNICHARM CORP·Filed 2022·Application pending·0 cites
- 1549US9535136B2Magnetic field probeMURATA MANUFACTURING CO·Filed 2014·Granted Jan 3, 2017·0 cites·5 claims
- 1647US2021069031A1Absorbent articleUNICHARM CORP·Filed 2020·Application pending·0 cites
- 1745US2008299686A1Method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Application pending·0 cites
- 1839US2012329369A1Substrate processing method and substrate processing apparatusSHIMIZU NORIKO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →