Inventor · disambiguated record
Nobutaka Shimizu
Also filed as: SHIMIZU NOBUTAKA
27 granted patents·6 pending applications·511 citations·filing 1990–2022
96Inventor score
Top patents by PatentIndex Score
33 records- 0197US5081067ACeramic package type semiconductor device and method of assembling the sameFUJITSU LTD·Filed 1991·Granted Jan 14, 1992·152 cites·22 claims
- 0293US6794273B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·81 cites·8 claims
- 0390US10549033B2Infusion pumpTERUMO CORP·Filed 2015·Granted Feb 4, 2020·12 cites·20 claims
- 0489US6875638B2Manufacturing method of a semiconductor device incorporating a passive element and a redistribution boardFUJITSU LTD·Filed 2002·Granted Apr 5, 2005·44 cites·16 claims
- 0588US6995044B2Manufacturing method of a semiconductor device incorporating a passive element and a redistribution boardFUJITSU LTD·Filed 2003·Granted Feb 7, 2006·36 cites·8 claims
- 0687US10022494B2Infusion pumpTERUMO CORP·Filed 2015·Granted Jul 17, 2018·8 cites·8 claims
- 0785US6566748B1Flip-chip semiconductor device having an improved reliabilityFUJITSU LTD·Filed 2000·Granted May 20, 2003·42 cites·11 claims
- 0884US8932700B2PanelSHIMIZU NOBUTAKA·Filed 2011·Granted Jan 13, 2015·12 cites·13 claims
- 0982US10008432B2Semiconductor device, manufacturing method thereof, and electronic apparatusSOCIONEXT INC·Filed 2016·Granted Jun 26, 2018·4 cites·17 claims
- 1080US5055914ACeramic package type semiconductor device and method of assembling the sameFUJITSU LTD·Filed 1990·Granted Oct 8, 1991·37 cites·19 claims
- 1177US10030388B2Panel having recesses and protrusionsNIPPON STEEL & SUMITOMO METAL CORP·Filed 2014·Granted Jul 24, 2018·6 cites·12 claims
- 1277US9069886B2Home medical apparatusSHIMIZU NOBUTAKA·Filed 2011·Granted Jun 30, 2015·20 cites·3 claims
- 1375US11794555B2Heat pump system for vehicle air conditioning devicesSANDEN HOLDINGS CORP·Filed 2019·Granted Oct 24, 2023·1 cites·4 claims
- 1475US7754534B2Semiconductor device and manufacturing method thereofFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jul 13, 2010·5 cites·27 claims
- 1571US12479270B2Heat medium temperature adjustment systemSANDEN CORP·Filed 2022·Granted Nov 25, 2025·0 cites·11 claims
- 1671US9224711B2Method for manufacturing a semiconductor device having multiple heat sinksFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Dec 29, 2015·2 cites·11 claims
- 1767US10598565B2Deformation mode analysis method for member of structure, structure reinforcement method using deformation mode analysis method, computer program for deformation mode analysis of structure, and recording mediumNIPPON STEEL & SUMITOMO METAL CORP·Filed 2015·Granted Mar 24, 2020·1 cites·23 claims
- 1862US6239486B1Semiconductor device having capFUJITSU LTD·Filed 1999·Granted May 29, 2001·28 cites·6 claims
- 1960US12454165B2Vehicle air conditioning apparatusSANDEN CORP·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2059US10556397B2Exterior panel and manufacturing method of exterior panelNIPPON STEEL CORP·Filed 2017·Granted Feb 11, 2020·0 cites·20 claims
- 2158USD668117SPlateSHIMIZU NOBUTAKA·Filed 2011·Granted Oct 2, 2012·10 cites·1 claims
- 2256US2024399825A1Vehicle heat management systemSANDEN CORP·Filed 2022·Application pending·0 cites
- 2355US2024375485A1Vehicle air conditioning apparatusSANDEN CORP·Filed 2022·Application pending·0 cites
- 2451US9721866B2Semiconductor device having multiple bonded heat sinksSOCIONEXT INC·Filed 2015·Granted Aug 1, 2017·0 cites·11 claims
- 2546US8979104B2Front body structureNIWA TOSHIYUKI·Filed 2012·Granted Mar 17, 2015·1 cites·3 claims
- 2644US2024119823A1Vehicle occupant detection device, and execution timing control methodSHIMIZU NOBUTAKA·Filed 2021·Application pending·0 cites
- 2741USD667695SPlateSHIMIZU NOBUTAKA·Filed 2011·Granted Sep 25, 2012·4 cites·1 claims
- 2841USD667696SPlateSHIMIZU NOBUTAKA·Filed 2011·Granted Sep 25, 2012·4 cites·1 claims
- 2941US2004232549A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2004·Application pending·0 cites
- 3038US2012135699A1Superheterodyne receiver apparatus, superheterodyne receiving method and semiconductor integrated circuit for superheterodyne receiver apparatusSHIMIZU NOBUTAKA·Filed 2010·Application pending·0 cites
- 3136US2019185063A1Work vehicleKOMATSU MFG CO LTD·Filed 2017·Application pending·0 cites
- 3232USD671369SPlateSHIMIZU NOBUTAKA·Filed 2011·Granted Nov 27, 2012·1 cites·1 claims
- 3330US9716049B2Semiconductor device and manufacturing method of semiconductor deviceSOCIONEXT INC·Filed 2015·Granted Jul 25, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →