Inventor · disambiguated record
Nobuo Tajima
Also filed as: TAJIMA NOBUO
8 granted patents·4 pending applications·222 citations·filing 1988–2019
85Inventor score
Top patents by PatentIndex Score
12 records- 0191US6009782ATable sawMAKITA CORP·Filed 1998·Granted Jan 4, 2000·146 cites·9 claims
- 0276US4958057ATransfer-type plasma torch with ring-shaped cathode and with processing gas passage provide interiorly of the cathodeNIPPON STEEL CORP·Filed 1989·Granted Sep 18, 1990·41 cites·4 claims
- 0369US8497391B2Insulating film material, method of film formation using insulating film material, and insulating filmOHNO TAKAHISA·Filed 2009·Granted Jul 30, 2013·3 cites·4 claims
- 0469US4994326ASolder powders coated with fluorine compounds, and solder pastesTAMURA KAKEN CO LTD·Filed 1988·Granted Feb 19, 1991·31 cites·5 claims
- 0564US10301581B2Liquid composition for cleaning semiconductor device, method for cleaning semiconductor device, and method for fabricating semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted May 28, 2019·1 cites·15 claims
- 0646US11441109B2Cleaning solution for removing dry etching residue and method for manufacturing semiconductor substrate using sameMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 0745US10186596B2Silicon carbide (SiC) MOSFET with a silicon oxide layer capable of suppressing deterioration of carrier mobility and variation in threshold voltageTOSHIBA KK·Filed 2017·Granted Jan 22, 2019·0 cites·14 claims
- 0845US2010112361A1Method of removing lead, reclaimed metals and reclaimed productsTAMURA KAKEN CORP·Filed 2009·Application pending·0 cites
- 0944US2014341800A1Method for producing aqueous hydrogen peroxide solutionTAJIMA NOBUO·Filed 2012·Application pending·0 cites
- 1033US10449638B2Solder composition and electronic boardTAMURA SEISAKUSHO KK·Filed 2017·Granted Oct 22, 2019·0 cites·3 claims
- 1132US2011313184A1Insulating film material, and film formation method utilizing the material, and insulating filmTAJIMA NOBUO·Filed 2010·Application pending·0 cites
- 1231US2017110363A1Liquid composition for cleaning semiconductor device, method for cleaning semiconductor device, and method for fabricating semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →