Inventor · disambiguated record
Nobuo Takeda
Also filed as: TAKEDA NOBUO
29 granted patents·5 pending applications·282 citations·filing 1983–2023
96Inventor score
Files withBALL SEMICONDUCTOR INC5BALL WAVE INC5FUJI HEAVY IND LTD4SMALL POWER COMMUNICATION SYST4HITACHI GLOBAL STORAGE TECH2
Top patents by PatentIndex Score
34 records- 0192US6679118B1Accelerometer and spherical sensor type measuring instrumentTOKIMEC INC·Filed 2000·Granted Jan 20, 2004·47 cites·18 claims
- 0282US7633052B2Impact detection system with three or more optical fiber sensorsFUJI HEAVY IND LTD·Filed 2007·Granted Dec 15, 2009·11 cites·13 claims
- 0378US4484207AStatic induction transistor and semiconductor integrated circuit using hetero-junctionZAIDAN HOJIN HANDOTAI KENKYU·Filed 1983·Granted Nov 20, 1984·28 cites·5 claims
- 0476US7470888B2Damage detection systemFUJI HEAVY IND LTD·Filed 2007·Granted Dec 30, 2008·8 cites·12 claims
- 0576US7176448B2Damage detection system for structural composite material and method of detecting damage to structural composite materialFUJI HEAVY IND LTD·Filed 2004·Granted Feb 13, 2007·22 cites·29 claims
- 0676US6061118AReflection system for imaging on a nonplanar substrateBALL SEMICONDUCTOR INC·Filed 1999·Granted May 9, 2000·37 cites·17 claims
- 0773US11307176B2Standard-moisture generator, system using the standard-moisture generator, method for detecting abnormality in standard-moisture and computer program product for detecting the abnormalityBALL WAVE INC·Filed 2019·Granted Apr 19, 2022·1 cites·9 claims
- 0873US7696471B2Impact detection system using an optical fiber sensorFUJI HEAVY IND LTD·Filed 2007·Granted Apr 13, 2010·7 cites·20 claims
- 0969US10145786B2Bonded structure and bonding-condition detecting methodMITSUBISHI HEAVY IND LTD·Filed 2014·Granted Dec 4, 2018·1 cites·10 claims
- 1064US5060029AStep cut type insulated gate SIT having low-resistance electrode and method of manufacturing the sameSMALL POWER COMMUNICATION SYST·Filed 1990·Granted Oct 22, 1991·24 cites·4 claims
- 1163US8746991B2Repairing method, repairing structure and connecting structure of embedded optical fiber of composite material structureTAKEDA NOBUO·Filed 2012·Granted Jun 10, 2014·3 cites·9 claims
- 1258US6840683B2Embedded light transfer medium with a protection tube and an elastic coveringKAWASAKI HEAVY IND LTD·Filed 2003·Granted Jan 11, 2005·7 cites·15 claims
- 1356US2023236191A1Virus test device, virus test system, virus test method, and virus test programBALL WAVE INC·Filed 2023·Application pending·0 cites
- 1454US7145633B2Apparatus and method of exposing light to a semiconductor device having a curved surfaceYAMATAKE CORP·Filed 2003·Granted Dec 5, 2006·5 cites·22 claims
- 1554US6558877B1Jet coating method for semiconductor processingBALL SEMICONDUCTOR INC·Filed 2000·Granted May 6, 2003·5 cites·15 claims
- 1653US6052517ASpherical cell design for VLSI circuit design on a spherical semiconductorBALL SEMICONDUCTOR INC·Filed 1998·Granted Apr 18, 2000·29 cites·21 claims
- 1752US8559018B2Detection method of crack occurrence positionTAKEDA NOBUO·Filed 2008·Granted Oct 15, 2013·2 cites·2 claims
- 1850US11982659B2System, method and program for calibrating moisture sensorBALL WAVE INC·Filed 2021·Granted May 14, 2024·0 cites·5 claims
- 1950US10345515B2Bonded structure, method for manufacturing the same, and bonding state detection methodMITSUBISHI HEAVY IND LTD·Filed 2016·Granted Jul 9, 2019·0 cites·18 claims
- 2046US11333631B2System, method and computer program product for measuring gas concentrationBALL WAVE INC·Filed 2017·Granted May 17, 2022·0 cites·20 claims
- 2145US6909182B2Spherical semiconductor device and method for fabricating the sameBALL SEMICONDUCTOR CORP·Filed 2002·Granted Jun 21, 2005·3 cites·10 claims
- 2245US6509645B2Spherical semiconductor device and method for fabricating the sameNIPPON STEEL CORP·Filed 1999·Granted Jan 21, 2003·10 cites·1 claims
- 2345US6251765B1Manufacturing metal dip solder bumps for semiconductor devicesBALL SEMICONDUCTOR INC·Filed 1999·Granted Jun 26, 2001·11 cites·16 claims
- 2444US11313836B2System, method and computer program product for gas analysisBALL WAVE INC·Filed 2019·Granted Apr 26, 2022·0 cites·19 claims
- 2543US5169795AMethod of manufacturing step cut type insulated gate SIT having low-resistance electrodeSMALL POWER COMMUNICATION SYST·Filed 1991·Granted Dec 8, 1992·9 cites·9 claims
- 2642US7587550B2Functional test method and functional test apparatus for data storage devicesHITACHI GLOBAL STORAGE TECH·Filed 2006·Granted Sep 8, 2009·0 cites·17 claims
- 2741US2007041870A1Sensor head, gas sensor and sensor unitBALL SEMICONDUCTOR LTD·Filed 2004·Application pending·0 cites
- 2839US10518484B2Bonded structureUNIV TOKYO·Filed 2016·Granted Dec 31, 2019·0 cites·5 claims
- 2938US5227336ATungsten chemical vapor deposition methodSMALL POWER COMMUNICATION SYST·Filed 1991·Granted Jul 13, 1993·10 cites·2 claims
- 3038US2002132462A1Spherical semiconductor device and method for fabricating the sameNIPPON STEEL CORP·Filed 2001·Application pending·0 cites
- 3134US2003150268A1System and method for reducing electric discharge breakdown in electrostatically levitated MEMS devicesBALL SEMICONDUCTOR INC·Filed 2002·Application pending·0 cites
- 3231US2008163705A1Test chamber apparatusHITACHI GLOBAL STORAGE TECH·Filed 2008·Application pending·0 cites
- 3329US5115287AStep-cut insulated gate static induction transistors and method of manufacturing the sameJAPAN RES DEV CORP·Filed 1991·Granted May 19, 1992·1 cites·8 claims
- 3425US5475242ANotched insulation gate static induction transistor integrated circuitSMALL POWER COMMUNICATION SYST·Filed 1995·Granted Dec 12, 1995·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →