Inventor · disambiguated record
Nobuyuki Takeyasu
Also filed as: TAKEYASU NOBUYUKI
11 granted patents·1 pending application·506 citations·filing 1993–2012
93Inventor score
Top patents by PatentIndex Score
12 records- 0190US5627102AMethod for making metal interconnection with chlorine plasma etchKAWASAKI STEEL CO·Filed 1995·Granted May 6, 1997·89 cites·23 claims
- 0290US5486492AMethod of forming multilayered wiring structure in semiconductor deviceKAWASAKI STEEL CO·Filed 1993·Granted Jan 23, 1996·115 cites·40 claims
- 0380US6063703AMethod for making metal interconnectionKAWASAKI STEEL CO·Filed 1998·Granted May 16, 2000·49 cites·54 claims
- 0480US5973402AMetal interconnection and method for makingKAWASAKI STEEL CO·Filed 1997·Granted Oct 26, 1999·48 cites·20 claims
- 0575US5952723ASemiconductor device having a multilevel interconnection structureKAWASAKI STEEL CO·Filed 1997·Granted Sep 14, 1999·42 cites·33 claims
- 0675US5627345AMultilevel interconnect structureKAWASAKI STEEL CO·Filed 1994·Granted May 6, 1997·45 cites·92 claims
- 0772US6001736AMethod of manufacturing semiconductor device and an apparatus for manufacturing the sameKAWASAKI STEEL CO·Filed 1996·Granted Dec 14, 1999·48 cites·37 claims
- 0866US5652180AMethod of manufacturing semiconductor device with contact structureKAWASAKI STEEL CO·Filed 1994·Granted Jul 29, 1997·35 cites·25 claims
- 0961US5637534AMethod of manufacturing semiconductor device having multilevel interconnection structureKAWASAKI STEEL CO·Filed 1993·Granted Jun 10, 1997·26 cites·64 claims
- 1058US2009242381A1Photoreduction processing method of three-dimensional metal nanostructureRIKEN·Filed 2009·Application pending·0 cites
- 1157US8372249B2Photoreduction processing method of three-dimensional metal nanostructureRIKEN·Filed 2012·Granted Feb 12, 2013·0 cites·3 claims
- 1243US5946799AMultilevel interconnect method of manufacturingKAWASAKI STEEL CO·Filed 1996·Granted Sep 7, 1999·9 cites·66 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →