Inventor · disambiguated record
Nobuyuki Tamura
Also filed as: TAMURA NOBUYUKI
27 granted patents·5 pending applications·238 citations·filing 1990–2024
96Inventor score
Files withDISCMA AG7YAZAKI CORP5FUJITSU LTD4MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4MATSUSHITA ELECTRONICS CORP2
Top patents by PatentIndex Score
32 records- 0188US9789641B2Blow molding device and method for manufacturing a containerDISCMA AG·Filed 2013·Granted Oct 17, 2017·7 cites·13 claims
- 0287US9610744B2Blow molding device and a method for manufacturing a containerDISCMA AG·Filed 2012·Granted Apr 4, 2017·7 cites·18 claims
- 0387US9180621B2Blow molding deviceDISCMA AG·Filed 2013·Granted Nov 10, 2015·7 cites·8 claims
- 0486US7350779B2Strut mountTOYO TIRE & RUBBER CO·Filed 2005·Granted Apr 1, 2008·21 cites·4 claims
- 0585US6169307B1Nonvolatile semiconductor memory device comprising a memory transistor, a select transistor, and an intermediate diffusion layerMATSUSHITA ELECTRONICS CORP·Filed 1998·Granted Jan 2, 2001·51 cites·19 claims
- 0681US7577098B2Device and method for network monitoringFUJITSU LTD·Filed 2005·Granted Aug 18, 2009·13 cites·8 claims
- 0774US9421708B2Blow molding deviceDISCMA AG·Filed 2013·Granted Aug 23, 2016·2 cites·4 claims
- 0874US5085444ADust seal for sliding type bushNISSAN MOTOR·Filed 1990·Granted Feb 4, 1992·42 cites·7 claims
- 0972US9579841B2Blow molding deviceMORIKAMI SHIGEKI·Filed 2013·Granted Feb 28, 2017·3 cites·5 claims
- 1072US9555574B2Blow molding device and a method for manufacturing a blow molded containerDISCMA AG·Filed 2012·Granted Jan 31, 2017·1 cites·16 claims
- 1169US6657893B2Nonvolatile semiconductor memory device and method for driving the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 2, 2003·14 cites·22 claims
- 1266US7271414B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Sep 18, 2007·4 cites·7 claims
- 1365US10186795B2Electrical contact member, plated terminal, terminal-attached electrical wire, and wire harnessYAZAKI CORP·Filed 2018·Granted Jan 22, 2019·2 cites·6 claims
- 1463US7018890B2Non-volatile semiconductor memory device and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 28, 2006·7 cites·19 claims
- 1561US6377490B1Nonvolatile semiconductor memory device and method for driving the sameMATSUSHITA ELECTRONICS CORP·Filed 2000·Granted Apr 23, 2002·10 cites·9 claims
- 1660US11108171B2Terminal, and terminal-attached cable and wire harness with the terminalYAZAKI CORP·Filed 2020·Granted Aug 31, 2021·0 cites·9 claims
- 1759US7050434B2Digital transmission apparatus for transmitting asynchronous frames by accomodating them in synchronous framesFUJITSU LTD·Filed 2002·Granted May 23, 2006·9 cites·8 claims
- 1857US10305210B2Terminal plating material, and terminal, terminal-equipped electric wire and wire harness using the sameYAZAKI CORP·Filed 2018·Granted May 28, 2019·0 cites·9 claims
- 1954US5737010ASystem for connection and disconnection in multipoint conference system of cascade configurationFUJITSU LTD·Filed 1994·Granted Apr 7, 1998·21 cites·9 claims
- 2053US2024360579A1Plating material, and terminal-equipped electric wire, connector, and wire harness using the sameYAZAKI CORP·Filed 2024·Application pending·0 cites
- 2149US10493684B2Composite container manufacturing method, molding die, and composite containerDISCMA AG·Filed 2015·Granted Dec 3, 2019·0 cites·13 claims
- 2249US10189594B2Method for manufacturing a container containing a content fluid, a method for placing an inside of a container under a positive pressure, a filled container, a blow molding method, and a blow molding deviceDISCMA AG·Filed 2013·Granted Jan 29, 2019·0 cites·11 claims
- 2348US6992977B2Transmission apparatus and a method for transmitting data in a data transmission systemFUJITSU LTD·Filed 2001·Granted Jan 31, 2006·2 cites·5 claims
- 2447US9713899B2Blow molding deviceSHIOKAWA MITSURU·Filed 2014·Granted Jul 25, 2017·0 cites·2 claims
- 2542US10347997B2Terminal-equipped electrical wire and wire harness using the sameYAZAKI CORP·Filed 2016·Granted Jul 9, 2019·0 cites·18 claims
- 2641US6655666B2Liquid-sealed vibration-proof deviceTOYO TIRE & RUBBER CO·Filed 2002·Granted Dec 2, 2003·3 cites·6 claims
- 2741US6472281B2Method for fabricating semiconductor device using a CVD insulator filmDACC DOCUMENT UPDATE·Filed 1999·Granted Oct 29, 2002·12 cites·7 claims
- 2841US2007278589A1Semiconductor device and fabrication method thereofTAMURA NOBUYUKI·Filed 2007·Application pending·0 cites
- 2940US2011303406A1Air-conditioning system and control device thereofTAKEDA JUN·Filed 2011·Application pending·0 cites
- 3037US2003080366A1Non-volatile semiconductor memory device and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Application pending·0 cites
- 3131US7812374B2Semiconductor device and fabrication method thereofPANASONIC CORP·Filed 2007·Granted Oct 12, 2010·0 cites·15 claims
- 3227US2002041064A1Bushing type mountFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →