Inventor · disambiguated record
Nobuyuki Terasaki
Also filed as: TERASAKI NOBUYUKI
52 granted patents·17 pending applications·106 citations·filing 2010–2023
97Inventor score
Top patents by PatentIndex Score
69 records- 0192US9066433B2Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2012·Granted Jun 23, 2015·6 cites·16 claims
- 0290US10173282B2Bonded body and power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jan 8, 2019·4 cites·20 claims
- 0390US9905437B2Method of producing bonded body and method of producing power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Feb 27, 2018·4 cites·19 claims
- 0489US11881439B2Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined body production method, and insulating circuit substrate production methodMITSUBISHI MATERIALS CORP·Filed 2020·Granted Jan 23, 2024·2 cites·8 claims
- 0589US9786577B2Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power moduleMITSUBISHI MATERIALS CORP·Filed 2015·Granted Oct 10, 2017·7 cites·3 claims
- 0688US10818585B2Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2018·Granted Oct 27, 2020·5 cites·20 claims
- 0787US11393738B2Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2017·Granted Jul 19, 2022·5 cites·5 claims
- 0887US11177186B2Bonded body and insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2018·Granted Nov 16, 2021·5 cites·7 claims
- 0986US9480144B2Power module substrate, power module substrate with heat sink, and power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted Oct 25, 2016·8 cites·8 claims
- 1085US10319664B2Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sinkMITSUBISHI MATERIALS CORP·Filed 2016·Granted Jun 11, 2019·4 cites·13 claims
- 1185US9723707B2Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 1, 2017·7 cites·12 claims
- 1282US11638350B2Copper/ceramic bonded body, insulating circuit board, method for producing copper/ceramic bonded body, and method for producing insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2020·Granted Apr 25, 2023·1 cites·8 claims
- 1381US9807865B2Substrate for power modules, substrate with heat sink for power modules, and power moduleMITSUBISHI MATERIALS CORP·Filed 2014·Granted Oct 31, 2017·5 cites·12 claims
- 1479US10370303B2Process for producing bonded body and process for producing power module substrateMITSUBISHI MATERIALS CORP·Filed 2015·Granted Aug 6, 2019·3 cites·12 claims
- 1577US10798824B2Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion moduleMITSUBISHI MATERIALS CORP·Filed 2017·Granted Oct 6, 2020·3 cites·15 claims
- 1677US9833855B2Method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Dec 5, 2017·4 cites·20 claims
- 1777US9504144B2Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding pasteMITSUBISHI MATERIALS CORP·Filed 2013·Granted Nov 22, 2016·4 cites·8 claims
- 1875US11062974B2Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2017·Granted Jul 13, 2021·2 cites·7 claims
- 1975US11028022B2Copper-ceramic bonded body and insulation circuit substrateMITSUBISHI MATERIALS CORP·Filed 2017·Granted Jun 8, 2021·2 cites·6 claims
- 2074US10497637B2Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sinkMITSUBISHI MATERIALS CORP·Filed 2016·Granted Dec 3, 2019·2 cites·10 claims
- 2174US10199237B2Method for manufacturing bonded body and method for manufacturing power-module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Feb 5, 2019·3 cites·23 claims
- 2273US10103035B2Copper-ceramic bonded body and power module substrateMITSUBISHI MATERIALS CORP·Filed 2015·Granted Oct 16, 2018·2 cites·4 claims
- 2373US9735085B2Bonded body, power module substrate, power module and method for producing bonded bodyMITSUBISHI MATERIALS CORP·Filed 2015·Granted Aug 15, 2017·2 cites·18 claims
- 2473US9414512B2Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power moduleNAGATOMO YOSHIYUKI·Filed 2010·Granted Aug 9, 2016·5 cites·4 claims
- 2570US10998250B2Bonded body and insulating circuit substrateMITSUBISHI MATERIALS CORP·Filed 2018·Granted May 4, 2021·1 cites·20 claims
- 2670US10016956B2Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jul 10, 2018·2 cites·23 claims
- 2770US9648737B2Bonded body and power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted May 9, 2017·2 cites·5 claims
- 2868US9764416B2Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power moduleMITSUBISHI MATERIALS CORP·Filed 2014·Granted Sep 19, 2017·2 cites·25 claims
- 2967US9968012B2Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 8, 2018·2 cites·8 claims
- 3065US12168634B2Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production methodMITSUBISHI MATERIALS CORP·Filed 2019·Granted Dec 17, 2024·0 cites·6 claims
- 3163US9560755B2Bonding body, power module substrate, and heat-sink-attached power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jan 31, 2017·1 cites·20 claims
- 3261US10011093B2Bonding structure of aluminum member and copper memberMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 3, 2018·1 cites·3 claims
- 3359US12089342B2Insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 3459US12037294B2Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production methodMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jul 16, 2024·0 cites·8 claims
- 3559US2025365859A1Copper/ceramic bonded body and insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2023·Application pending·0 cites
- 3658US12199006B2Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2022·Granted Jan 14, 2025·0 cites·4 claims
- 3758US2021068251A1Power module substrate, power module substrate with heat sink, power module, method of producing power module substrate, paste for copper sheet bonding, and method of producing bonded bodyMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 3857US12451404B2Copper-ceramic bonded body, insulated circuit board, method for producing copper-ceramic bonded body, and method for producing insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2020·Granted Oct 21, 2025·0 cites·6 claims
- 3957US12002732B2Copper/ceramic assembly, insulated circuit board, method for producing copper/ceramic assembly, and method for producing insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2020·Granted Jun 4, 2024·0 cites·20 claims
- 4056US2024414841A1Copper/ceramic joined body and insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 4155US10410951B2Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sinkMITSUBISHI MATERIALS CORP·Filed 2017·Granted Sep 10, 2019·0 cites·6 claims
- 4255US2022410529A1Ceramic/copper/graphene assembly and method for manufacturing same, and ceramic/copper/graphene joining structureMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 4354US12125765B2Copper/ceramic joined body and insulating circuit substrateMITSUBISHI MATERIALS CORP·Filed 2020·Granted Oct 22, 2024·0 cites·8 claims
- 4454US2024363480A1Copper/ceramic bonded body and insulating circuit substrateMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 4554US2024234242A1Copper/ceramic assembly and insulating circuit substrateMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 4654US2024363481A1Copper/ceramic bonded body and insulating circuit substrateMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 4753US11396059B2Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production methodMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jul 26, 2022·0 cites·8 claims
- 4853US2024203819A1Copper/ceramic bonded body and insulating circuit substrateMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 4951US9530717B2Bonded body and power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Dec 27, 2016·0 cites·10 claims
- 5050US12035468B2Bonded body, insulated circuit board with heat sink, and heat sinkMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jul 9, 2024·0 cites·3 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →