Inventor · disambiguated record
Nobuyuki Umezaki
Also filed as: UMEZAKI NOBUYUKI
4 granted patents·51 citations·filing 1997–2014
74Inventor score
Top patents by PatentIndex Score
4 records- 0173US6483191B2Semiconductor device having reinforced coupling between solder balls and substrateNEC CORP·Filed 2001·Granted Nov 19, 2002·26 cites·7 claims
- 0254US5841706ASemiconductor memory device capable of high speed operation in low power supply voltageNEC CORP·Filed 1997·Granted Nov 24, 1998·20 cites·16 claims
- 0350US10195769B2Forming mold for gasket and method of manufacturing the gasketNOK CORP·Filed 2014·Granted Feb 5, 2019·0 cites·2 claims
- 0447US6808959B2Semiconductor device having reinforced coupling between solder balls and substrateNEC ELECTRONICS CORP·Filed 2002·Granted Oct 26, 2004·5 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →