Inventor · disambiguated record
Norihito Yabuki
Also filed as: YABUKI NORIHITO
8 granted patents·9 pending applications·11 citations·filing 2013–2025
78Inventor score
Top patents by PatentIndex Score
17 records- 0183US9644894B2Semiconductor device manufacturing apparatusTOYO TANSO CO·Filed 2014·Granted May 9, 2017·6 cites·9 claims
- 0269US2025353135A1Surface processing methodDENSO CORP·Filed 2025·Application pending·0 cites
- 0365US10014176B2SiC substrate treatment methodTOYO TANSO CO·Filed 2015·Granted Jul 3, 2018·1 cites·12 claims
- 0463US9704733B2Storing container, storing container manufacturing method, semiconductor manufacturing method, and semiconductor manufacturing apparatusTOYO TANSO CO·Filed 2013·Granted Jul 11, 2017·1 cites·7 claims
- 0563US9570306B2Surface treatment method for single crystal SiC substrate, and single crystal SiC substrateTOYO TANSO CO·Filed 2013·Granted Feb 14, 2017·1 cites·12 claims
- 0662US10388536B2Etching method for SiC substrate and holding containerTOYO TANSO CO·Filed 2015·Granted Aug 20, 2019·1 cites·2 claims
- 0762US9991175B2Method for estimating depth of latent scratches in SiC substratesTOYO TANSO CO·Filed 2015·Granted Jun 5, 2018·1 cites·8 claims
- 0848US10665465B2Surface treatment method for SiC substrateKWANSEI GAKUIN EDUCATIONAL FOUND·Filed 2015·Granted May 26, 2020·0 cites·16 claims
- 0947US2018069084A1METHOD FOR MANUFACTURING THIN SiC WAFER AND THIN SiC WAFERTOYO TANSO CO·Filed 2017·Application pending·0 cites
- 1045US2022376109A1Semiconductor device and method for manufacturing sameHITACHI LTD·Filed 2020·Application pending·0 cites
- 1145US2017236905A1METHOD FOR MANUFACTURING THIN SiC WAFER AND THIN SiC WAFERTOYO TANSO CO·Filed 2016·Application pending·0 cites
- 1243US2021375613A1SiC WAFER MANUFACTURING METHODTOYO TANSO CO·Filed 2019·Application pending·0 cites
- 1343US2019010629A1METHOD FOR MANUFACTURING SINGLE-CRYSTAL SiC, AND HOUSING CONTAINERTOYO TANSO CO·Filed 2016·Application pending·0 cites
- 1442US10665485B2Heat treatment vessel for single-crystal silicon carbide substrate and etching methodTOYO TANSO CO·Filed 2016·Granted May 26, 2020·0 cites·15 claims
- 1541US2022002905A1Method for manufacturing device fabrication waferTOYO TANSO CO·Filed 2019·Application pending·0 cites
- 1631US2017114475A1METHOD FOR REMOVING WORK-AFFECTED LAYER ON SiC SEED CRYSTAL, SiC SEED CRYSTAL, AND SiC SUBSTRATE MANUFACTURING METHODTOYO TANSO CO·Filed 2015·Application pending·0 cites
- 1731US2017121848A1SURFACE TREATMENT METHOD FOR SiC SUBSTRATES, SiC SUBSTRATE, AND SEMICONDUCTOR PRODUCTION METHODTOYO TANSO CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →