Inventor · disambiguated record
Norio Yamanishi
Also filed as: YAMANISHI NORIO
9 granted patents·7 pending applications·87 citations·filing 2004–2021
86Inventor score
Files withSHINKO ELECTRIC IND CO6TOSHIBA MACHINE CO LTD4KAJIKI ATSUNORI2YAMANISHI NORIO2AKAIKE SADAKAZU1
Top patents by PatentIndex Score
16 records- 0192US7261596B2Shielded semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Aug 28, 2007·43 cites·6 claims
- 0288US8208268B2Semiconductor apparatusKAJIKI ATSUNORI·Filed 2008·Granted Jun 26, 2012·24 cites·10 claims
- 0386US9511465B2Precision machine toolTOSHIBA MACHINE CO LTD·Filed 2013·Granted Dec 6, 2016·7 cites·12 claims
- 0481US11424192B2Component-embedded substrateSHINKO ELECTRIC IND CO·Filed 2021·Granted Aug 23, 2022·1 cites·16 claims
- 0579US10252391B2Precision machine toolTOSHIBA MACHINE CO LTD·Filed 2016·Granted Apr 9, 2019·2 cites·27 claims
- 0677US7267642B2Automatic tool changing device and working machineTOSHIBA MACHINE CO LTD·Filed 2006·Granted Sep 11, 2007·8 cites·6 claims
- 0756US9406620B2Semiconductor packageYAMANISHI NORIO·Filed 2012·Granted Aug 2, 2016·1 cites·14 claims
- 0847US2009146314A1Semiconductor DeviceSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 0946US8441278B2Stacked semiconductor device and method of connection test in the sameYAMANISHI NORIO·Filed 2010·Granted May 14, 2013·1 cites·6 claims
- 1044US2014037397A1Manufacturing method of machine tool and machine toolTOSHIBA MACHINE CO LTD·Filed 2013·Application pending·0 cites
- 1143US2008165513A1Electronic component built-in substrate and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 1239US7911042B2Package having shield caseSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 22, 2011·0 cites·7 claims
- 1338US2004235287A1Method of manufacturing semiconductor package and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2004·Application pending·0 cites
- 1437US2006125077A1Semiconductor deviceAKAIKE SADAKAZU·Filed 2005·Application pending·0 cites
- 1537US2006113679A1Semiconductor deviceTAKATSU HIROYUKI·Filed 2005·Application pending·0 cites
- 1636US2006113642A1Semiconductor deviceKAJIKI ATSUNORI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →