Inventor · disambiguated record
Numair Ahmed
Also filed as: AHMED NUMAIR
2 granted patents·19 pending applications·0 citations·filing 2019–2024
23Inventor score
Files withINTEL CORP21
Top patents by PatentIndex Score
21 records- 0157US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0256US2025210469A1Mixed depth cavity for embedded bridge structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 0355US2025112165A1Anisotropic conductive connections for interconnect bridges and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 0454US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 0553US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0653US2025218911A1Electrolytic cobalt-iron-palladium-gold as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 0753US2025219002A1Electrolytic indium-palladium-gold as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 0852US2025218910A1Immersion gold-electroless palladium-immersion gold (igepig) as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 0952US2024395661A1In-situ micro-fluidic channels for heat dissipation in glass substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 1052US2025218925A1Electroless nickel-electroless palladium-immersion gold (enepig) with thin nickel layer as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 1152US2024222018A1Substrate package-integrated oxide capacitors and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 1252US2025218924A1Electroless nickel-electroless palladium-immersion gold (enepig) as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 1351US2024312853A1Via structures in bonded glass substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1451US2024312888A1Via structures in bonded glass substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1550US2024327201A1Mems dies embedded in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1650US2024105575A1Electrolytic surface finish architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1748US12224253B2Magnetic inductor device and methodINTEL CORP·Filed 2021·Granted Feb 11, 2025·0 cites·27 claims
- 1846US11735551B2Aligned core balls for interconnect joint stabilityINTEL CORP·Filed 2019·Granted Aug 22, 2023·0 cites·20 claims
- 1946US2022199503A1Novel lga architecture for improving reliability performance of metal defined padsINTEL CORP·Filed 2020·Application pending·0 cites
- 2044US2023317642A1Electronic device substrate having a passive electronic componentINTEL CORP·Filed 2022·Application pending·0 cites
- 2144US2022165695A1Porous fli bumps for reducing bump thickness variation sensitivity to enable bump pitch scalingINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →