Inventor · disambiguated record
Nungpyo Hong
Also filed as: HONG NUNGPYO
2 granted patents·1 pending application·0 citations·filing 2020–2024
23Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0150US2025070079A1Manufacturing method of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0247US11581202B2Substrate debonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 0345US11942344B2Method of determining a critical temperature of a semiconductor package and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →