Inventor · disambiguated record
Nurfarena Othman
Also filed as: OTHMAN NURFARENA
4 granted patents·2 pending applications·3 citations·filing 2018–2024
59Inventor score
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
6 records- 0168US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 0263US10840172B2Leadframe, semiconductor package including a leadframe and method for forming a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 17, 2020·1 cites·15 claims
- 0352US2025054831A1Method for fabricating topside cooled semiconductor packages by film assisted molding and a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0438US2020343167A1Leaded Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 0536US10914018B2Porous Cu on Cu surface for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 9, 2021·0 cites·28 claims
- 0636US10770399B2Semiconductor package having a filled conductive cavityINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 8, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →