Inventor · disambiguated record
Octavio Trovarelli
Also filed as: MEYER THORSTEN · TROVARELLI OCTAVIO
11 granted patents·3 pending applications·22 citations·filing 2004–2007
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0162US7393782B2Process for producing layer structures for signal distributionINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 1, 2008·3 cites·25 claims
- 0261US8124521B2Electrical through contactHEDLER HARRY·Filed 2007·Granted Feb 28, 2012·2 cites·41 claims
- 0361US7271095B2Process for producing metallic interconnects and contact surfaces on electronic componentsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 18, 2007·2 cites·20 claims
- 0458US7115496B2Method for protecting the redistribution layer on wafers/chipsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 3, 2006·8 cites·26 claims
- 0557US7906421B2Method for applying solder to redistribution linesQIMONDA AG·Filed 2007·Granted Mar 15, 2011·1 cites·28 claims
- 0655US7390742B2Method for producing a rewiring printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 24, 2008·1 cites·21 claims
- 0744US7368375B2Electronic component with compliant elevations having electrical contact areas and method for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 6, 2008·2 cites·23 claims
- 0844US7169647B2Connection between a semiconductor chip and an external conductor structure and method for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 30, 2007·2 cites·13 claims
- 0941US7235859B2Arrangement and process for protecting fuses/anti-fusesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 26, 2007·1 cites·25 claims
- 1038US7172966B2Method for fabricating metallic interconnects on electronic componentsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 6, 2007·0 cites·20 claims
- 1138US2005277230A1Process for producing a chip arrangement provided with a molding compoundBRINTZINGER AXEL·Filed 2005·Application pending·0 cites
- 1237US7332430B2Method for improving the mechanical properties of BOC module arrangementsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 19, 2008·0 cites·19 claims
- 1337US2005275085A1Arrangement for reducing the electrical crosstalk on a chipBRINTZINGER AXEL·Filed 2005·Application pending·0 cites
- 1436US2006270104A1Method for attaching dice to a package and arrangement of dice in a packageTROVARELLI OCTAVIO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →