Inventor · disambiguated record
Oh Jin Jung
Also filed as: JUNG OH-JIN
7 granted patents·15 pending applications·53 citations·filing 2007–2015
81Inventor score
Top patents by PatentIndex Score
22 records- 0186US8039962B2Semiconductor chip, method of fabricating the same and stack package having the sameDONGBU HITEK CO LTD·Filed 2008·Granted Oct 18, 2011·16 cites·8 claims
- 0286US7994613B2Semiconductor device and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2008·Granted Aug 9, 2011·14 cites·9 claims
- 0386US7964959B2Semiconductor chip, method of fabricating the same and stacked package having the sameDONGBU HITEK CO LTD·Filed 2008·Granted Jun 21, 2011·19 cites·5 claims
- 0472US8691610B1Semiconductor device and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2013·Granted Apr 8, 2014·3 cites·10 claims
- 0555US7687316B2Method for adhering semiconductor devicesDONGBU HITEK CO LTD·Filed 2008·Granted Mar 30, 2010·1 cites·14 claims
- 0654US2010078638A1Image sensor and method for fabricating the sameLEE HAN-CHOON·Filed 2009·Application pending·0 cites
- 0752US2013221471A1Backside illuminated image-sensor and method for manufacturing the sameJUNG OH JIN·Filed 2012·Application pending·0 cites
- 0851US2010078750A1Image sensor and method for fabricating the sameJUNG OH-JIN·Filed 2009·Application pending·0 cites
- 0946US2008315198A1Image sensor and method for manufacturing the sameJUNG OH JIN·Filed 2007·Application pending·0 cites
- 1045US2010090219A1Method for fabrication of semiconductor deviceJUNG OH-JIN·Filed 2009·Application pending·0 cites
- 1144US2015078724A1Remote audio recording camera systemSENA TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 1243US2010140775A1Semiconductor device and method for manufacturing the sameJUNG OH JIN·Filed 2009·Application pending·0 cites
- 1343US2010019390A1Semiconductor device, semiconductor chip, manufacturing methods thereof, and stack packageJUNG OH-JIN·Filed 2009·Application pending·0 cites
- 1443US2010012934A1Semiconductor chip and semiconductor chip stacked packageJUNG OH-JIN·Filed 2009·Application pending·0 cites
- 1543US2009014830A1Method of manufacturing semiconductor deviceLEE MIN-HYUNG·Filed 2008·Application pending·0 cites
- 1643US2010078746A1Semiconductor device and method of manufacturing the sameJUNG OH-JIN·Filed 2009·Application pending·0 cites
- 1742US9156681B2Semiconductor device and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2013·Granted Oct 13, 2015·0 cites·14 claims
- 1841US8760843B2Capacitive device and method for fabricating the sameHWANG JONG TAEK·Filed 2012·Granted Jun 24, 2014·0 cites·18 claims
- 1941US2009026614A1System in package and method for fabricating the sameJUNG OH-JIN·Filed 2008·Application pending·0 cites
- 2041US2015105022A1Multitasking system of bluetooth headsetSENA TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 2141US2008286899A1Method for manufacturing semiconductor device and method for manufacturing system-in-package using the sameJUNG OH-JIN·Filed 2008·Application pending·0 cites
- 2233US2015248048A1Apparatus for affixing a cameraSENA TECHNOLOGIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →