Inventor · disambiguated record
Ohguk Kwon
Also filed as: KWON OHGUK
7 granted patents·2 pending applications·1 citations·filing 2021–2023
70Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0182US11545417B2Integrated circuit device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·1 cites·20 claims
- 0272US11990452B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 21, 2024·0 cites·18 claims
- 0371US11887913B2Integrated circuit device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 0464US11626385B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 0553US11735566B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·19 claims
- 0652US11710757B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·19 claims
- 0752US2024096841A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0852US2024055403A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0948US11545512B2Image sensor package with underfill and image sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →