Inventor · disambiguated record

Okseon Yoon

Also filed as: YOON OKSEON

1 granted patent·6 pending applications·0 citations·filing 2022–2024

13Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD7

Top patents by PatentIndex Score

7 records

0160US12489081B2Semiconductor package including underfill and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·18 claims
0257US2025201749A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0356US2025105133A1Semiconductor package including insulating materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0456US2025167153A1Method of forming redistribution pad and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0548US2024266188A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
0645US2023112891A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
0742US2023154841A1Semiconductor package having redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →