Inventor · disambiguated record
Oladeji Fadayomi
Also filed as: FADAYOMI OLADEJI · FADAYOMI OLADEJI T
1 granted patent·5 pending applications·0 citations·filing 2020–2023
7Inventor score
Files withINTEL CORP6
Top patents by PatentIndex Score
6 records- 0152US2024222249A1Integrated circuit device package substrates with glass core layer having roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 0251US2024222130A1Enabling copper recess flattening through blocked copper etching processesINTEL CORP·Filed 2022·Application pending·0 cites
- 0351US2024282591A1Tools and methods for surface levelingINTEL CORP·Filed 2023·Application pending·0 cites
- 0450US2024222137A1Enabling copper recess flattening through a dfr patterning processesINTEL CORP·Filed 2022·Application pending·0 cites
- 0549US2024101413A1Self-aligned air gap formation in microelectronics packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 0646US12191161B2Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductorsINTEL CORP·Filed 2020·Granted Jan 7, 2025·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →