Inventor · disambiguated record
Oliver Hellmund
Also filed as: HELLMUND OLIVER
23 granted patents·2 pending applications·18 citations·filing 2007–2022
91Inventor score
Top patents by PatentIndex Score
25 records- 0184US10566426B2Forming silicon oxide layers by radical oxidation and semiconductor device with silicon oxide layerINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 18, 2020·4 cites·27 claims
- 0284US9761548B1Bond pad structureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Sep 12, 2017·5 cites·16 claims
- 0382US10325804B2Method of wafer thinning and realizing backside metal structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 18, 2019·3 cites·22 claims
- 0477US11011409B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 18, 2021·1 cites·20 claims
- 0572US9960076B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 1, 2018·1 cites·29 claims
- 0669US10553675B2Isolation of semiconductor device with buried cavityINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·1 cites·8 claims
- 0769US8025783B2Method for producing a composite material, associated composite material and associated semiconductor circuit arrangementsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 27, 2011·3 cites·28 claims
- 0861US12107130B2Semiconductor device having semiconductor device elements in a semiconductor layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 1, 2024·0 cites·16 claims
- 0960US10535553B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 14, 2020·0 cites·14 claims
- 1059US12300759B2Method of manufacturing a hybrid deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted May 13, 2025·0 cites·14 claims
- 1156US11552048B2Semiconductor device including an electrical contact with a metal layer arranged thereonINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 10, 2023·0 cites·17 claims
- 1256US11038028B2Semiconductor device and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 15, 2021·0 cites·17 claims
- 1354US11069626B2Molding compound and semiconductor package with a molding compoundINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 1453US10707865B2Switch deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jul 7, 2020·0 cites·16 claims
- 1548US10158356B2Switch deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Dec 18, 2018·0 cites·25 claims
- 1647US10199332B2Method of manufacturing a semiconductor device comprising a support element and semiconductor device comprising a support elementINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 5, 2019·0 cites·24 claims
- 1747US10121859B2Method of manufacturing semiconductor devices with transistor cells and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 6, 2018·0 cites·22 claims
- 1843US10199372B2Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 5, 2019·0 cites·25 claims
- 1942US10074566B2Semiconductor device and methods for forming a plurality of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·0 cites·32 claims
- 2042US8922016B2Method for producing a composite material, associated composite material and associated semiconductor circuit arrangementsHELLMUND OLIVER·Filed 2011·Granted Dec 30, 2014·0 cites·20 claims
- 2140US10177033B2Methods for forming a semiconductor device and semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jan 8, 2019·0 cites·19 claims
- 2239US10373868B2Method of processing a porous conductive structure in connection to an electronic component on a substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·0 cites·20 claims
- 2338US2018144982A1Semiconductor devices and methods for manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 2437US9875926B2Substrates with buried isolation layers and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 23, 2018·0 cites·25 claims
- 2535US2017031239A1Structuring over topographyINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →