Inventor · disambiguated record
Omkar G. Karhade
Also filed as: KARHADE OMKAR · KARHADE OMKAR G · KARHADE OMKAR GOPALKRISHNA
97 granted patents·83 pending applications·227 citations·filing 2013–2025
99Inventor score
Top patents by PatentIndex Score
180 records- 0198US9275955B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2013·Granted Mar 1, 2016·49 cites·17 claims
- 0297US11521931B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Dec 6, 2022·7 cites·18 claims
- 0397US9754890B2Embedded multi-device bridge with through-bridge conductive via signal connectionINTEL CORP·Filed 2014·Granted Sep 5, 2017·35 cites·20 claims
- 0496US11373972B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Jun 28, 2022·9 cites·18 claims
- 0594US12412842B2Microelectronic structures including bridgesINTEL CORP·Filed 2023·Granted Sep 9, 2025·2 cites·20 claims
- 0694US9899238B2Low cost package warpage solutionINTEL CORP·Filed 2014·Granted Feb 20, 2018·11 cites·13 claims
- 0794US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0893US10068852B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2017·Granted Sep 4, 2018·8 cites·19 claims
- 0992US12399334B2Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2021·Granted Aug 26, 2025·2 cites·20 claims
- 1092US12392970B2Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2021·Granted Aug 19, 2025·2 cites·20 claims
- 1192US10192810B2Underfill material flow control for reduced die-to-die spacing in semiconductor packagesINTEL CORP·Filed 2013·Granted Jan 29, 2019·13 cites·9 claims
- 1292US9607947B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2016·Granted Mar 28, 2017·8 cites·9 claims
- 1391US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 1491US10741419B2Low cost package warpage solutionINTEL CORP·Filed 2019·Granted Aug 11, 2020·4 cites·20 claims
- 1590US12061371B2Patch on interposer architecture for low cost optical co-packagingINTEL CORP·Filed 2020·Granted Aug 13, 2024·2 cites·25 claims
- 1690US9716067B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2016·Granted Jul 25, 2017·6 cites·6 claims
- 1790US9041205B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2013·Granted May 26, 2015·10 cites·8 claims
- 1889US2025096009A1Low cost package warpage solutionINTEL CORP·Filed 2024·Application pending·0 cites
- 1985US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 2085US12183596B2Low cost package warpage solutionINTEL CORP·Filed 2023·Granted Dec 31, 2024·0 cites·18 claims
- 2185US9576942B1Integrated circuit assembly that includes stacked diceINTEL CORP·Filed 2015·Granted Feb 21, 2017·4 cites·14 claims
- 2284US12476174B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2384US12347780B2Integrated circuit package with flipped high bandwidth memory deviceINTEL CORP·Filed 2021·Granted Jul 1, 2025·1 cites·20 claims
- 2484US11328937B2Low cost package warpage solutionINTEL CORP·Filed 2020·Granted May 10, 2022·1 cites·33 claims
- 2584US9741692B2Methods to form high density through-mold interconnectionsKARHADE OMKAR G·Filed 2014·Granted Aug 22, 2017·7 cites·14 claims
- 2683US9502368B2Picture frame stiffeners for microelectronic packagesINTEL CORP·Filed 2014·Granted Nov 22, 2016·5 cites·11 claims
- 2780US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 2880US10797000B2Embedded multi-device bridge with through-bridge conductive via signal connectionINTEL CORP·Filed 2019·Granted Oct 6, 2020·2 cites·14 claims
- 2980US9685421B2Methods for high precision microelectronic die integrationINTEL CORP·Filed 2015·Granted Jun 20, 2017·3 cites·17 claims
- 3080US2025060531A1Photonic integrated circuit packaging architectureINTEL CORP·Filed 2024·Application pending·0 cites
- 3179US12406914B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 3279US12027448B2Open cavity bridge power delivery architectures and processesINTEL CORP·Filed 2020·Granted Jul 2, 2024·1 cites·11 claims
- 3379US11764080B2Low cost package warpage solutionINTEL CORP·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 3479US10229882B2Embedded multi-device bridge with through-bridge conductive via signal connectionINTEL CORP·Filed 2017·Granted Mar 12, 2019·2 cites·19 claims
- 3577US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 3677US10256198B2Warpage control for microelectronics packagesINTEL CORP·Filed 2017·Granted Apr 9, 2019·2 cites·21 claims
- 3776US9391025B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2015·Granted Jul 12, 2016·2 cites·8 claims
- 3876US2022344247A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3975US10109616B2High bandwidth, low profile multi-die packageINTEL CORP·Filed 2016·Granted Oct 23, 2018·2 cites·23 claims
- 4074US9583470B2Electronic device with solder pads including projectionsINTEL CORP·Filed 2013·Granted Feb 28, 2017·3 cites·8 claims
- 4174US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 4274US2025038163A1Optical multichip package with multiple system-on-chip diesINTEL CORP·Filed 2024·Application pending·0 cites
- 4372US11676900B2Electronic assembly that includes a bridgeINTEL CORP·Filed 2015·Granted Jun 13, 2023·2 cites·12 claims
- 4471US10290561B2Thermal interfaces for integrated circuit packagesINTEL CORP·Filed 2016·Granted May 14, 2019·2 cites·13 claims
- 4570US12181710B2Photonic integrated circuit packaging architectureINTEL CORP·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 4670US10672626B2Method and materials for warpage thermal and interconnect solutionsINTEL CORP·Filed 2017·Granted Jun 2, 2020·1 cites·7 claims
- 4770US9397071B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2013·Granted Jul 19, 2016·2 cites·12 claims
- 4870US2024136292A1Microelectronic structures including bridgesINTEL CORP·Filed 2023·Application pending·0 cites
- 4969US12443058B2On-cavity photonic integrated circuit (OCPIC) to achieve the most undercut real estate for effective thermal tuningINTEL CORP·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 5069US12436413B2Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC)INTEL CORP·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
Showing the top 50 of 180 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Omkar G. Karhade files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →