Inventor · disambiguated record
Omin Kwon
Also filed as: KWON OMIN
11 granted patents·4 pending applications·14 citations·filing 2014–2025
85Inventor score
Top patents by PatentIndex Score
15 records- 0196US11393698B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jul 19, 2022·4 cites·22 claims
- 0294US11990424B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2023·Granted May 21, 2024·2 cites·22 claims
- 0394US11862478B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jan 2, 2024·2 cites·25 claims
- 0491US11616025B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 0590US11664327B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 30, 2023·2 cites·22 claims
- 0689US11959691B2Refrigerator and home applianceLG ELECTRONICS INC·Filed 2022·Granted Apr 16, 2024·2 cites·18 claims
- 0779US12266615B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 1, 2025·0 cites·23 claims
- 0875US2025201729A1Selective EMI Shielding Using Preformed Mask with Fang DesignSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0973US12469796B2Method of forming an embedded magnetic shielding deviceSTATS CHIPPAC PTE LTD·Filed 2022·Granted Nov 11, 2025·0 cites·23 claims
- 1072US12438099B2Semiconductor device and method of forming EMI shielding material in two-step process to avoid contaminating electrical connectorSTATS CHIPPAC PTE LTD·Filed 2022·Granted Oct 7, 2025·0 cites·25 claims
- 1171US12298058B2Refrigerator and home applianceLG ELECTRONICS INC·Filed 2024·Granted May 13, 2025·0 cites·17 claims
- 1260US2024234270A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1358US2024055368A1Semiconductor devices with pyramidal shielding and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1453US2024014093A1Semiconductor Device and Method of Heat Dissipation Using GrapheneSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
- 1547US9673171B1Integrated circuit packaging system with coreless substrate and method of manufacture thereofCHI HEEJO·Filed 2014·Granted Jun 6, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →