Inventor · disambiguated record
On Lok Chau
Also filed as: CHAU ON L · CHAU ON LOK
8 granted patents·3 pending applications·17 citations·filing 2005–2022
80Inventor score
Top patents by PatentIndex Score
11 records- 0184US12512450B2Semiconductor device and a method of manufacturing a semiconductor deviceNexperia BV·Filed 2022·Granted Dec 30, 2025·1 cites·5 claims
- 0274US7262494B2Three-dimensional packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 28, 2007·7 cites·7 claims
- 0367US7279409B2Method for forming multi-layer bumps on a substrateFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 9, 2007·4 cites·13 claims
- 0464US7422973B2Method for forming multi-layer bumps on a substrateFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Sep 9, 2008·3 cites·18 claims
- 0560US7494924B2Method for forming reinforced interconnects on a substrateFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 24, 2009·2 cites·9 claims
- 0657US11990394B2Semiconductor package and a method for manufacturing of a semiconductor packageNexperia BV·Filed 2021·Granted May 21, 2024·0 cites·19 claims
- 0747US2007178228A1Method for fabricating a PCBSHIU HEI M·Filed 2006·Application pending·0 cites
- 0846US11631634B2Leadless semiconductor package and method of manufactureNexperia BV·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 0943US2022262711A1Semiconductor device and a method of manufacturing a semiconductor deviceNexperia BV·Filed 2022·Application pending·0 cites
- 1042US10269751B2Leadless package with non-collapsible bumpNexperia BV·Filed 2016·Granted Apr 23, 2019·0 cites·17 claims
- 1134US2017170103A1Electronic device and manufacturing method thereforNexperia BV·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →