Inventor · disambiguated record
Onur Ozkan
Also filed as: OZKAN ONUR
1 granted patent·9 pending applications·0 citations·filing 2021–2023
9Inventor score
Top patents by PatentIndex Score
10 records- 0155US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US12334422B2Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substratesINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·24 claims
- 0351US2024096809A1Microelectronic assemblies with mixed copper and solder interconnects having different thicknessesINTEL CORP·Filed 2022·Application pending·0 cites
- 0451US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 0549US2024006298A1Substrate having one or more electrical interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 0645US2023086180A1Deformable semiconductor device connectionINTEL CORP·Filed 2021·Application pending·0 cites
- 0744US2023086649A1Semiconductor Chip Package Having Internal I/O Structures With Modulated Thickness To Compensate For Die/Substrate WarpageINTEL CORP·Filed 2021·Application pending·0 cites
- 0844US2024079530A1Ic package with micro ledsINTEL CORP·Filed 2022·Application pending·0 cites
- 0943US2024215163A1Substrate glass core patterning for ctv improvement and layer count reductionINTEL CORP·Filed 2022·Application pending·0 cites
- 1042US2024079259A1Dual sided glass carriers for making package substratesINTEL CORP·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Onur Ozkan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →