Inventor · disambiguated record
Ori Golani
Also filed as: GOLANI ORI
7 granted patents·4 pending applications·13 citations·filing 2017–2024
76Inventor score
Top patents by PatentIndex Score
11 records- 0193US11195267B1Multi-perspective wafer analysis using an acousto-optic deflectorAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Dec 7, 2021·4 cites·20 claims
- 0291US11035803B1Multi-perspective examination of a specimenAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Jun 15, 2021·3 cites·17 claims
- 0374US10056069B2Wearable noise cancellation deviceSILENT PARTNER LTD·Filed 2017·Granted Aug 21, 2018·6 cites·30 claims
- 0473US11859963B2Depth profiling of semiconductor structures using picosecond ultrasonicsAPPLIED MATERIALS ISRAEL LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 0566US2025165663A1Methods and systems for obtaining a 3d profile of a sampleAPPLIED MATERIALS ISRAEL LTD·Filed 2024·Application pending·0 cites
- 0664US11519720B2Depth profiling of semiconductor structures using picosecond ultrasonicsAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Dec 6, 2022·0 cites·20 claims
- 0760US2025189435A1Acoustic resonance-based metrology of samplesAPPLIED MATERIALS ISRAEL LTD·Filed 2023·Application pending·0 cites
- 0860US2025116597A1Model-based acousto-optic depth-metrology of specimensAPPLIED MATERIALS ISRAEL LTD·Filed 2023·Application pending·0 cites
- 0959US12278085B2Hybrid scanning electron microscopy and acousto-optic based metrologyAPPLIED MATERIALS ISRAEL LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 1059US2025155235A1Depth profiling of semiconductor structures using multi-wavelength pump-probe techniqueAPPLIED MATERIALS ISRAEL LTD·Filed 2023·Application pending·0 cites
- 1153US11815470B2Multi-perspective wafer analysisAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Nov 14, 2023·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →