Inventor · disambiguated record
Ordwin Haase
Also filed as: HAASE ORDWIN
9 granted patents·2 pending applications·40 citations·filing 2001–2024
84Inventor score
Top patents by PatentIndex Score
11 records- 0183US9069020B2Method and a circuit arrangement for determining a demagnetization zero current timeINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jun 30, 2015·7 cites·25 claims
- 0282US11018072B2Semiconductor package having overlapping electrically conductive regions and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 25, 2021·3 cites·26 claims
- 0370US12266586B2Double-sided coolable semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Apr 1, 2025·0 cites·13 claims
- 0469US6922073B2Circuit configuration for signal balancing in antiphase bus driversINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 26, 2005·15 cites·16 claims
- 0565US11515228B2Double sided semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 29, 2022·0 cites·13 claims
- 0659US2024313764A1Degradations detection for mos-transistors and gate-driversUNIV DEGLI STUDI DI MILANO BICOCCA·Filed 2024·Application pending·0 cites
- 0758US6362667B2Output driver circuitINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 26, 2002·9 cites·8 claims
- 0855US2025389762A1Integrated active isolation measurementINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0945US10985110B2Semiconductor package having an electromagnetic shielding structure and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 20, 2021·0 cites·17 claims
- 1043US11217504B2Semiconductor package with passive electrical component and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 4, 2022·0 cites·21 claims
- 1143US6882132B2DC voltage chopper for DC voltageINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 19, 2005·6 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →