Inventor · disambiguated record

Oswald Hainz

Also filed as: HAINZ OSWALD

1 granted patent·1 pending application·9 citations·filing 1990–2001

31Inventor score

Technology areasH10W

Files withSIEMENS AG1

Top patents by PatentIndex Score

2 records

0131US2002076852A1Method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plasticFiled 2001·Application pending·0 cites
0224US5138428AConnection of a semiconductor component to a metal carrierSIEMENS AG·Filed 1990·Granted Aug 11, 1992·9 cites·17 claims

Join the waitlist — get patent alerts

Get an alert when Oswald Hainz files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →