Inventor · disambiguated record
Osami Hayashi
Also filed as: HAYASHI OSAMI
4 granted patents·175 citations·filing 1987–1990
80Inventor score
Files withSHINETSU POLYMER CO4
Top patents by PatentIndex Score
4 records- 0189US4917466AMethod for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected therebySHINETSU POLYMER CO·Filed 1988·Granted Apr 17, 1990·87 cites·5 claims
- 0283US5041183AMethod for the preparation of a hot-melt adhesive interconnectorSHINETSU POLYMER CO·Filed 1990·Granted Aug 20, 1991·69 cites·6 claims
- 0358US4775578AColored ink ribbon of electrothermal transfer type for thermal printersSHINETSU POLYMER CO·Filed 1987·Granted Oct 4, 1988·8 cites·5 claims
- 0433US5034081AMethod for the preparation of an emboss-worked plastic cardSHINETSU POLYMER CO·Filed 1989·Granted Jul 23, 1991·11 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →