Inventor · disambiguated record
Osamu Inui
Also filed as: INUI OSAMU
10 granted patents·7 pending applications·140 citations·filing 1983–2023
87Inventor score
Top patents by PatentIndex Score
17 records- 0192US4633120AElectrostriction transducer comprising electrostriction layers of axially varied thicknessesNIPPON ELECTRIC CO·Filed 1984·Granted Dec 30, 1986·66 cites·7 claims
- 0280US4518887ADifferential lever actuator including differentially force-transmitting members which are not liable to breakNEC CORP·Filed 1984·Granted May 21, 1985·34 cites·12 claims
- 0374US10477671B2Laminated bodySEKISUI CHEMICAL CO LTD·Filed 2016·Granted Nov 12, 2019·1 cites·14 claims
- 0473US4595854ADrive circuit for piezoelectric stackNEC CORP·Filed 1984·Granted Jun 17, 1986·23 cites·19 claims
- 0572US12077677B2Method for manufacturing cured film, method for manufacturing electronic component, and electronic componentSEKISUI CHEMICAL CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·17 claims
- 0667US4589786AImpact printer head capable of printing a dot at a distance narrower than a thickness of a printer unitNEC CORP·Filed 1983·Granted May 20, 1986·15 cites·12 claims
- 0758US11459443B2Resin material, method for producing resin material, and laminateSEKISUI CHEMICAL CO LTD·Filed 2018·Granted Oct 4, 2022·0 cites·14 claims
- 0857US11220604B2Method for manufacturing cured film, method for manufacturing electronic component, and electronic componentSEKISUI CHEMICAL CO LTD·Filed 2014·Granted Jan 11, 2022·0 cites·17 claims
- 0952US8519429B2Encapsulant for optical semiconductor device and optical semiconductor device using sameTANIKAWA MITSURU·Filed 2011·Granted Aug 27, 2013·1 cites·16 claims
- 1048US2025354012A1Silicone composition, heat dissipation member, and electronic deviceSEKISUI CHEMICAL CO LTD·Filed 2023·Application pending·0 cites
- 1146US2025376611A1Silicone composition, heat dissipating member, and electronic apparatusSEKISUI CHEMICAL CO LTD·Filed 2023·Application pending·0 cites
- 1244US2020216659A1Resin material, method for producing resin material, and laminateSEKISUI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
- 1342US11492528B2Heat dissipation sheet, method for producing heat dissipation sheet, and laminateSEKISUI CHEMICAL CO LTD·Filed 2018·Granted Nov 8, 2022·0 cites·14 claims
- 1434US2014175505A1Sealing agent for optical semiconductor devices, and optical semiconductor deviceYAMAZAKI RYOSUKE·Filed 2012·Application pending·0 cites
- 1533US2017158922A1Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic partSEKISUI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
- 1633US2013221400A1Encapsulating agent for optical semiconductor devices, and optical semiconductor device using sameTANIKAWA MITSURU·Filed 2011·Application pending·0 cites
- 1730US2012126282A1Sealant for optical semiconductors and optical semiconductor deviceTANIKAWA MITSURU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →