Inventor · disambiguated record

Oseob Jeon

Also filed as: JEON OSEOB

33 granted patents·31 pending applications·104 citations·filing 2002–2025

96Inventor score

Technology areasH10W H01L

Files withSEMICONDUCTOR COMPONENTS IND LLC43 FAIRCHILD SEMICONDUCTOR7 NAVITAS SEMICONDUCTOR LTD6 JEON OSEOB3 FAIRCHILD KR SEMICONDUCTOR LTD1

Top patents by PatentIndex Score

64 records

0194US8183088B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2010·Granted May 22, 2012·22 cites·14 claims
0291US12368085B2Integration of semiconductor device assemblies with thermal dissipation mechanismsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 22, 2025·1 cites·20 claims
0391US11615967B2Power module package and method of manufacturing the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Mar 28, 2023·2 cites·20 claims
0491US10403601B2Semiconductor package and related methodsFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Sep 3, 2019·7 cites·17 claims
0587US10090279B2Stray inductance reduction in packaged semiconductor devices and modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 2, 2018·7 cites·20 claims
0687US8664752B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2012·Granted Mar 4, 2014·9 cites·10 claims
0786US8193043B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameJEON OSEOB·Filed 2010·Granted Jun 5, 2012·9 cites·18 claims
0885US9177925B2Apparatus related to an improved package including a semiconductor dieFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Nov 3, 2015·7 cites·29 claims
0983US11031379B2Stray inductance reduction in packaged semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 8, 2021·4 cites·20 claims
1083US8487371B2Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the sameKINZER DANIEL M·Filed 2011·Granted Jul 16, 2013·7 cites·16 claims
1182US7800219B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Sep 21, 2010·10 cites·9 claims
1281US11961782B2Integration of semiconductor device assemblies with thermal dissipation mechanismsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 16, 2024·1 cites·15 claims
1381US11037907B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 15, 2021·2 cites·20 claims
1479US11901309B2Semiconductor device package assemblies with direct leadframe attachmentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 13, 2024·2 cites·18 claims
1579US8890310B2Power module package having excellent heat sink emission capability and method for manufacturing the sameLEE KEUNHYUK·Filed 2010·Granted Nov 18, 2014·9 cites·9 claims
1678US2024234246A1Integrated circuit direct cooling systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
1778US2025391738A1Jet impingement heatsink for high power semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1877US12315826B2Semiconductor device package assemblies with direct leadframe attachmentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 27, 2025·0 cites·19 claims
1977US10607919B2Semiconductor package having junction cooling pipes embedded in substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 31, 2020·2 cites·14 claims
2077US2025349662A1Integration of semiconductor device assemblies with thermal dissipation mechanismsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
2175US2025149512A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
2274US9478519B2Package including a semiconductor die and a capacitive componentFAIRCHILD SEMICONDUCTOR·Filed 2015·Granted Oct 25, 2016·2 cites·19 claims
2372US12266590B2Dual side direct cooling semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
2472US12230606B2Semiconductor package and related methodsFAIRCHILD SEMICONDUCTOR·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
2571US12400933B2Jet impingement heatsink for high power semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
2671US11967540B2Integrated circuit direct cooling systems having substrates in contact with a cooling mediumSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 23, 2024·0 cites·18 claims
2770US12230551B2Immersion direct cooling modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 18, 2025·0 cites·16 claims
2870US2025226284A1Thermal mismatch reduction in semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
2970US2025233050A1Dual side direct cooling semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
3069US12476397B2Transfer molded power modules and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
3168US12230601B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
3267US12471204B2Semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 11, 2025·0 cites·21 claims
3367US11201105B2Semiconductor package having a spacer with a junction cooling pipeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 14, 2021·0 cites·12 claims
3466US12272615B2Thermal mismatch reduction in semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 8, 2025·0 cites·19 claims
3566US2025192097A1High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
3664US11101198B2Semiconductor die package including a one-body clipSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 24, 2021·0 cites·21 claims
3763US11004698B2Power module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted May 11, 2021·1 cites·18 claims
3863US2025149406A1Immersion direct cooling modules and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
3963US2025149417A1Single-sided direct cooled power moduleNAVITAS SEMICONDUCTOR LTD·Filed 2024·Application pending·0 cites
4063US2025167082A1Electronic package with recessed terminalsNAVITAS SEMICONDUCTOR LTD·Filed 2024·Application pending·0 cites
4163US2025105112A1Electronic package with integral sealNAVITAS SEMICONDUCTOR LTD·Filed 2024·Application pending·0 cites
4263US2025105101A1Electronic package for high voltage applicationsNAVITAS SEMICONDUCTOR LTD·Filed 2024·Application pending·0 cites
4361US2024379526A1Power module with balanced current flowNAVITAS SEMICONDUCTOR LTD·Filed 2024·Application pending·0 cites
4460US2024194564A1Fluidic-channel cooled substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
4558US2024186218A1Molded power modules with fluidic-channel cooled substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
4658US2024363575A1Fan out package for a semiconductor power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
4757US2024055334A1Transfer molded power modules and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
4857US2024030108A1Transfer molded power modules and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
4956US2024128197A1Assemblies with embedded semiconductor device modules and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
5056US2023361011A1Molded power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites

Showing the top 50 of 64 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →