Inventor · disambiguated record
Osamu Kakutani
Also filed as: KAKUTANI OSAMU
29 granted patents·7 pending applications·183 citations·filing 1985–2023
96Inventor score
Top patents by PatentIndex Score
36 records- 0187US6505397B1Die holding mechanism for a die with connecting wires thereonSHINKAWA KK·Filed 2000·Granted Jan 14, 2003·32 cites·3 claims
- 0283US7886956B2Bonding apparatus and bonding stage height adjustment method for the bonding apparatusSHINKAWA KK·Filed 2010·Granted Feb 15, 2011·7 cites·6 claims
- 0377US7601454B2Polymer electrolyte fuel cellHONDA MOTOR CO LTD·Filed 2005·Granted Oct 13, 2009·3 cites·6 claims
- 0477US7389805B2Bonding arm swinging type bonding apparatusSHINKAWA KK·Filed 2005·Granted Jun 24, 2008·5 cites·4 claims
- 0575US8152043B2Ultrasonic hornKAKUTANI OSAMU·Filed 2011·Granted Apr 10, 2012·3 cites·9 claims
- 0673US8052026B2Ultrasonic hornSHINKAWA KK·Filed 2006·Granted Nov 8, 2011·4 cites·13 claims
- 0772US7306132B2Bonding apparatusSHINKAWA KK·Filed 2005·Granted Dec 11, 2007·6 cites·5 claims
- 0871US10350692B2Heater for bonding apparatus and method of cooling the sameSHINKAWA KK·Filed 2015·Granted Jul 16, 2019·3 cites·9 claims
- 0970US8511534B2Ultrasonic hornKAKUTANI OSAMU·Filed 2011·Granted Aug 20, 2013·2 cites·8 claims
- 1070US6760968B2Die packing deviceSHINKAWA KK·Filed 2001·Granted Jul 13, 2004·12 cites·3 claims
- 1164US8434656B2Ultrasonic hornKAKUTANI OSAMU·Filed 2011·Granted May 7, 2013·1 cites·16 claims
- 1263US4763827AManufacturing methodHITACHI LTD·Filed 1987·Granted Aug 16, 1988·28 cites·21 claims
- 1361US6383844B2Multi-chip bonding method and apparatusSHINKAWA KK·Filed 2000·Granted May 7, 2002·8 cites·3 claims
- 1460US6141865AWinding method and winding apparatus for producing stators for electric motorsHONDA MOTOR CO LTD·Filed 1998·Granted Nov 7, 2000·27 cites·6 claims
- 1559US4674670AManufacturing apparatusHITACHI LTD·Filed 1985·Granted Jun 23, 1987·25 cites·12 claims
- 1659US2025088058A1Three-Phase Coil Structure and Linear MotorPROTERIAL LTD·Filed 2023·Application pending·0 cites
- 1758US12080679B2Bonding apparatus and alignment methodSHINKAWA KK·Filed 2021·Granted Sep 3, 2024·0 cites·4 claims
- 1858US7226635B2Sealing material coating method for fuel cell-use separatorHONDA MOTOR CO LTD·Filed 2002·Granted Jun 5, 2007·5 cites·12 claims
- 1957US7096912B2Bonding apparatusSHINKAWA KK·Filed 2004·Granted Aug 29, 2006·6 cites·9 claims
- 2055US2006269655A1Process for producing electrolyte membrane-bonded electrode and varnish composition used thereinHONDA MOTOR CO LTD·Filed 2006·Application pending·0 cites
- 2153US12374650B2Manufacturing apparatus and manufacturing method of semiconductor deviceSHINKAWA KK·Filed 2021·Granted Jul 29, 2025·0 cites·10 claims
- 2251US6766936B2Transducer and a bonding apparatus using the sameSHINKAWA KK·Filed 2002·Granted Jul 27, 2004·5 cites·4 claims
- 2350US12057427B2Wire bonding apparatusSHINKAWA KK·Filed 2021·Granted Aug 6, 2024·0 cites·13 claims
- 2450US2008304772A1Hydrostatic guide systemSHINKAWA KK·Filed 2008·Application pending·0 cites
- 2549US7482089B2Fuel cellHONDA MOTOR CO LTD·Filed 2004·Granted Jan 27, 2009·1 cites·2 claims
- 2644US2004028806A1Process for producing electrolyte membrane-bonded electrode and varnish composition used thereinFiled 2003·Application pending·0 cites
- 2743US9576927B2Bonding tool cooling apparatus and method for cooling bonding toolSHINKAWA KK·Filed 2015·Granted Feb 21, 2017·0 cites·6 claims
- 2843US7828860B2Method of laminating fuel cell-use separator and film/electrode junction element and device thereforHONDA MOTOR CO LTD·Filed 2002·Granted Nov 9, 2010·0 cites·3 claims
- 2943US6685984B2Method for the production of multilayersJSR CORP·Filed 2003·Granted Feb 3, 2004·0 cites·7 claims
- 3041US2005274771A1Bonding apparatusSHINKAWA KK·Filed 2005·Application pending·0 cites
- 3140US10700585B2Linear motorHITACHI METALS LTD·Filed 2016·Granted Jun 30, 2020·0 cites·2 claims
- 3240US2005019649A1Method for manufacturing electrode for fuel cellFiled 2002·Application pending·0 cites
- 3340US2007141237A1Method for producing membrane-electrode assembly for fuel cellOKIYAMA GEN·Filed 2004·Application pending·0 cites
- 3439US10388555B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2016·Granted Aug 20, 2019·0 cites·5 claims
- 3539US7293686B2Bonding apparatusSHINKAWA KK·Filed 2004·Granted Nov 13, 2007·0 cites·4 claims
- 3625US10361166B2Bonding deviceSHINKAWA KK·Filed 2016·Granted Jul 23, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →