Inventor · disambiguated record
Osamu Kuwabara
Also filed as: KUWABARA OSAMU
20 granted patents·7 pending applications·643 citations·filing 1988–2023
96Inventor score
Files withCASIO COMPUTER CO LTD13SANYO ELECTRIC CO5TOSHIBA KK4PANASONIC IP MAN CO LTD2KOROKU TAISUKE1
Top patents by PatentIndex Score
27 records- 0197US6600234B2Mounting structure having columnar electrodes and a sealing filmCASIO COMPUTER CO LTD·Filed 2000·Granted Jul 29, 2003·212 cites·9 claims
- 0294US8347520B2Drying unit and laundry washing/drying machine equipped with the drying unitSANYO ELECTRIC CO·Filed 2008·Granted Jan 8, 2013·28 cites·12 claims
- 0391US5378859AFilm wiring boardCASIO COMPUTER CO LTD·Filed 1993·Granted Jan 3, 1995·133 cites·18 claims
- 0488US6603191B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2001·Granted Aug 5, 2003·55 cites·14 claims
- 0582US7631510B2Multi-stage refrigeration system including sub-cycle control characteristicsTHERMAL ANALYSIS PARTNERS LLC·Filed 2005·Granted Dec 15, 2009·14 cites·3 claims
- 0678US4902133AMethod and an apparatus for aligning first and second objects with each otherTOSHIBA KK·Filed 1988·Granted Feb 20, 1990·25 cites·49 claims
- 0776US8154133B2Semiconductor device having low dielectric constant film and manufacturing method thereofKOROKU TAISUKE·Filed 2009·Granted Apr 10, 2012·10 cites·10 claims
- 0876US6889512B2On-vehicle air conditionerSANYO ELECTRIC CO·Filed 2002·Granted May 10, 2005·24 cites·2 claims
- 0976US6601773B2Heat pump type hot water supply apparatusSANYO ELECTRIC CO·Filed 2002·Granted Aug 5, 2003·29 cites·9 claims
- 1069US6472249B1Semiconductor device having sealing film formed on the surface having columnar electrode formed thereon and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2000·Granted Oct 29, 2002·16 cites·31 claims
- 1167US5134640ASynchrotron radiation apparatusTOSHIBA KK·Filed 1991·Granted Jul 28, 1992·22 cites·18 claims
- 1267US4984890AMethod and an apparatus for aligning first and second objects with each otherTOSHIBA KK·Filed 1989·Granted Jan 15, 1991·15 cites·24 claims
- 1365US7104079B2Heat pumpSANYO ELECTRIC CO·Filed 2002·Granted Sep 12, 2006·14 cites·5 claims
- 1463US8584479B2Air conditioner having a desiccant rotor with moisture adsorbing areaKUWABARA OSAMU·Filed 2010·Granted Nov 19, 2013·3 cites·20 claims
- 1563US7863750B2Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2009·Granted Jan 4, 2011·3 cites·13 claims
- 1659US2025321035A1Refrigeration cycle devicePANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 1758US7944064B2Semiconductor device having alignment post electrode and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2007·Granted May 17, 2011·2 cites·11 claims
- 1857US5195113AX-ray exposure apparatus and method of positioning the sameTOSHIBA KK·Filed 1991·Granted Mar 16, 1993·14 cites·9 claims
- 1955US6319851B1Method for packaging semiconductor device having bump electrodesCASIO COMPUTER CO LTD·Filed 2000·Granted Nov 20, 2001·6 cites·20 claims
- 2053US2008223084A1Washing and drying machineSANYO ELECTRIC CO·Filed 2008·Application pending·0 cites
- 2147US5025348ABonding structure of an electronic device and a method for manufacturing the sameCASIO COMPUTER CO LTD·Filed 1988·Granted Jun 18, 1991·18 cites·18 claims
- 2246US2010144096A1Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective filmCASIO COMPUTER CO LTD·Filed 2009·Application pending·0 cites
- 2345US2010144097A1Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective filmCASIO COMPUTER CO LTD·Filed 2009·Application pending·0 cites
- 2445US2010144095A1Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective filmCASIO COMPUTER CO LTD·Filed 2009·Application pending·0 cites
- 2538US2017276416A1Refrigeration apparatusPANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 2637US2004238973A1Semiconductor device having alignment post electrode and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2004·Application pending·0 cites
- 2723US5148189AThermal print headCASIO COMPUTER CO LTD·Filed 1991·Granted Sep 15, 1992·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →