Inventor · disambiguated record
Osamu Munekata
Also filed as: MUNEKATA OSAMU
11 granted patents·8 pending applications·107 citations·filing 1997–2021
89Inventor score
Top patents by PatentIndex Score
19 records- 0190US7682468B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2007·Granted Mar 23, 2010·15 cites·9 claims
- 0285US6554180B1Lead-free solder pasteSENJU METAL INDUSTRY CO·Filed 2000·Granted Apr 29, 2003·37 cites·24 claims
- 0381US7338567B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Mar 4, 2008·19 cites·15 claims
- 0472US11344976B2Solder material, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Granted May 31, 2022·1 cites·19 claims
- 0568US10780531B2Solder ball, solder joint, and joining methodSENJU METAL INDUSTRY CO·Filed 2019·Granted Sep 22, 2020·1 cites·6 claims
- 0665US8216395B2Lead-free solder alloyMUNEKATA OSAMU·Filed 2010·Granted Jul 10, 2012·3 cites·9 claims
- 0765US6050480ASolder paste for chip componentsSENJU METAL INDUSTRY CO·Filed 1997·Granted Apr 18, 2000·18 cites·7 claims
- 0861US7029542B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Apr 18, 2006·8 cites·12 claims
- 0958US11583959B2Solder alloy, solder power, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1054US11712760B2Layered bonding material, semiconductor package, and power moduleSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 1, 2023·0 cites·29 claims
- 1154US2021245305A1Solder alloy, solder powder, solder paste, and a solder joint using theseSENJU METAL INDUSTRY CO·Filed 2019·Application pending·0 cites
- 1253US2022258288A1Solder alloy, solder powder, solder paste, and solder joint obtained using theseSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 1353US2023094946A1Metal Body, Fitting Connection Terminal, and Method for Forming Metal BodySENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 1451US2019358751A1Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1551US2021308808A1Solder alloy, solder powder, solder paste, and a solder joint using theseSENJU METAL INDUSTRY CO·Filed 2019·Application pending·0 cites
- 1650US2022250193A1Solder alloy, solder powder, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 1747US7628308B2Method of replenishing an oxidation suppressing element in a solder bathSENJU METAL INDUSTRY CO·Filed 2003·Granted Dec 8, 2009·5 cites·7 claims
- 1841US2003021718A1Lead-free solder alloyFiled 2002·Application pending·0 cites
- 1936US2017348805A1Solder alloy for plating and electronic componentSENJU METAL INDUSTRY CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →