Inventor · disambiguated record
Pascal Besson
Also filed as: BESSON PASCAL · BESSON PASCAL-HIPPOLYTE
7 granted patents·3 pending applications·26 citations·filing 2004–2021
78Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE4COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGEIS ALTERNATIVES1MARTY MICHEL1MÜLLER MARKUS1ST MICROELECTRONICS CROLLES 21
Top patents by PatentIndex Score
10 records- 0175US7641738B2Method of wet cleaning a surface, especially of a material of the silicon-germanium typeCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2007·Granted Jan 5, 2010·5 cites·20 claims
- 0275US7250085B2Method of wet cleaning a surface, especially of a material of the silicon-germanium typeCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2004·Granted Jul 31, 2007·18 cites·3 claims
- 0365US11380543B2Method for fabricating a monocrystalline structureCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Jul 5, 2022·1 cites·13 claims
- 0459US7491644B2Manufacturing process for a transistor made of thin layersCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted Feb 17, 2009·2 cites·23 claims
- 0559US2022037157A1Method of wafer assembly by molecular bondingST MICROELECTRONICS SA·Filed 2021·Application pending·0 cites
- 0642US8759174B2Selective removal of a silicon oxide layerMÜLLER MARKUS·Filed 2009·Granted Jun 24, 2014·0 cites·22 claims
- 0740US2007042687A1Method and device for feeding a chemical-mechanical polishing machine with a polishing productST MICROELECTRONICS CROLLES 2·Filed 2006·Application pending·0 cites
- 0839US8524522B2Microelectronic device, in particular back side illuminated image sensor, and production processMARTY MICHEL·Filed 2010·Granted Sep 3, 2013·0 cites·14 claims
- 0931US9831095B2Method for performing selective etching of a semiconductor material in solutionCOMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGEIS ALTERNATIVES·Filed 2016·Granted Nov 28, 2017·0 cites·23 claims
- 1025US2006190981A1Carousel technology for interactive televisionVISIWARE·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →