Inventor · disambiguated record
Patrick Blessing
Also filed as: BLESSING PATRICK
4 granted patents·1 pending application·30 citations·filing 2004–2008
73Inventor score
Files withBEHLER STEFAN1BLESSING PATRICK1ESEC AG1OERLIKON ASSEMBLY EQUIPMENT AG1UNAXIS INT TRADING LTD1
Top patents by PatentIndex Score
5 records- 0179US7597234B2Method for mounting a flip chip on a substrateOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2006·Granted Oct 6, 2009·16 cites·2 claims
- 0277US8133823B2Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrateBEHLER STEFAN·Filed 2008·Granted Mar 13, 2012·9 cites·17 claims
- 0362US8166637B2Apparatus for mounting a flip chip on a substrateBLESSING PATRICK·Filed 2008·Granted May 1, 2012·4 cites·4 claims
- 0439US7193727B2Apparatus and method for mounting or wiring semiconductor chipsUNAXIS INT TRADING LTD·Filed 2004·Granted Mar 20, 2007·1 cites·6 claims
- 0531US2010315655A1Method And Device For Measuring A Height DifferenceESEC AG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →