Inventor · disambiguated record
Patrick H. Buffet
Also filed as: BUFFET PATRICK H
21 granted patents·1 pending application·419 citations·filing 2000–2005
96Inventor score
Files withIBM21
Top patents by PatentIndex Score
22 records- 0191US6499134B1Method of assigning integrated circuit I/O signals in an integrated circuit packageIBM·Filed 2000·Granted Dec 24, 2002·81 cites·20 claims
- 0290US6631502B2Method of analyzing integrated circuit power distribution in chips containing voltage islandsIBM·Filed 2002·Granted Oct 7, 2003·88 cites·16 claims
- 0387US6523150B1Method of designing a voltage partitioned wirebond packageIBM·Filed 2001·Granted Feb 18, 2003·50 cites·27 claims
- 0482US6584596B2Method of designing a voltage partitioned solder-bump packageIBM·Filed 2001·Granted Jun 24, 2003·35 cites·36 claims
- 0577US6538314B1Power grid wiring for semiconductor devices having voltage islandsIBM·Filed 2002·Granted Mar 25, 2003·23 cites·19 claims
- 0675US6586828B2Integrated circuit bus grid having wires with pre-selected variable widthsIBM·Filed 2001·Granted Jul 1, 2003·21 cites·18 claims
- 0769US6978214B2Validation of electrical performance of an electronic package prior to fabricationIBM·Filed 2003·Granted Dec 20, 2005·12 cites·17 claims
- 0868US6606732B2Method for specifying, identifying, selecting or verifying differential signal pairs on IC packagesIBM·Filed 2000·Granted Aug 12, 2003·14 cites·17 claims
- 0967US6762367B2Electronic package having high density signal wires with low resistanceIBM·Filed 2002·Granted Jul 13, 2004·13 cites·26 claims
- 1066US6477057B1High frequency de-coupling via short circuitsIBM·Filed 2000·Granted Nov 5, 2002·12 cites·11 claims
- 1163US7454723B2Validation of electrical performance of an electronic package prior to fabricationIBM·Filed 2005·Granted Nov 18, 2008·2 cites·11 claims
- 1260US7017128B2Concurrent electrical signal wiring optimization for an electronic packageIBM·Filed 2003·Granted Mar 21, 2006·8 cites·9 claims
- 1360US6703706B2Concurrent electrical signal wiring optimization for an electronic packageIBM·Filed 2002·Granted Mar 9, 2004·8 cites·17 claims
- 1460US6677774B2Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic testerIBM·Filed 2001·Granted Jan 13, 2004·8 cites·6 claims
- 1560US6495911B1Scalable high frequency integrated circuit packageIBM·Filed 2000·Granted Dec 17, 2002·8 cites·11 claims
- 1659US7146596B2Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring gridIBM·Filed 2003·Granted Dec 5, 2006·10 cites·17 claims
- 1758US6924661B2Power switch circuit sizing techniqueIBM·Filed 2003·Granted Aug 2, 2005·8 cites·36 claims
- 1857US7038319B2Apparatus and method to reduce signal cross-talkIBM·Filed 2003·Granted May 2, 2006·8 cites·9 claims
- 1956US6483720B1EMC protection in digital computersIBM·Filed 2000·Granted Nov 19, 2002·5 cites·10 claims
- 2054US7064570B2Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic testerIBM·Filed 2003·Granted Jun 20, 2006·5 cites·19 claims
- 2139US7000203B2Efficient and comprehensive method to calculate IC package or PCB trace mutual inductance using circular segments and lookup tablesIBM·Filed 2003·Granted Feb 14, 2006·0 cites·20 claims
- 2238US2002186554A1Method for manufacturing a scalable high frequency integrated circuit packageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →