Inventor · disambiguated record
Paolo Casati
Also filed as: CASATI PAOLO
14 granted patents·3 pending applications·239 citations·filing 1984–2022
93Inventor score
Files withST MICROELECTRONICS SRL8SGS THOMSON MICROELECTRONICS5DEBI DERIVATI BIOLOGICI1SCLAVO SPA1SGS MICROELECTRONICS S R L1
Top patents by PatentIndex Score
17 records- 0184US7192200B2Optical communication moduleST MICROELECTRONICS SRL·Filed 2005·Granted Mar 20, 2007·14 cites·27 claims
- 0275US5763296AMethod for fabricating an electronic device structure with studs locating lead frame on backing plateST MICROELECTRONICS SRL·Filed 1994·Granted Jun 9, 1998·49 cites·3 claims
- 0368US6002173ASemiconductor device package with metal-polymer joint of controlled roughnessSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Dec 14, 1999·40 cites·19 claims
- 0466US5521439ACombination and method for coupling a heat sink to a semiconductor deviceSGS MICROELECTRONICS S R L·Filed 1994·Granted May 28, 1996·38 cites·17 claims
- 0555US5338971AElectronic device structure with studs locating lead frame on backing plateST MICROELECTRONICS SRL·Filed 1992·Granted Aug 16, 1994·22 cites·28 claims
- 0653US7459771B2Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing processST MICROELECTRONICS SRL·Filed 2003·Granted Dec 2, 2008·6 cites·4 claims
- 0752US5353194AModular power circuit assemblySGS THOMSON MICROELECTRONICS·Filed 1993·Granted Oct 4, 1994·23 cites·22 claims
- 0851US6473310B1Insulated power multichip packageST MICROELECTRONICS SRL·Filed 2000·Granted Oct 29, 2002·5 cites·17 claims
- 0948US5244838AProcess and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power deviceSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Sep 14, 1993·16 cites·4 claims
- 1043US2023042407A1Method of manufacturing semiconductor devices and corresponding semiconductor device method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 1141US5370517AApparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power deviceSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Dec 6, 1994·11 cites·14 claims
- 1241US4664852AProcess for the preparation of L-carnitineSCLAVO SPA·Filed 1986·Granted May 12, 1987·2 cites·16 claims
- 1339US5445995AMethod for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sinkSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Aug 29, 1995·10 cites·20 claims
- 1439US2005189625A1Lead-frame for electonic devices with extruded padsFiled 2005·Application pending·0 cites
- 1536US2018053709A1Method for manufacturing semiconductor devices, and corresponding deviceST MICROELECTRONICS SRL·Filed 2017·Application pending·0 cites
- 1631US4613460AProcess for preparing α-L-aspartyl-L-phenylalanine methyl esterDEBI DERIVATI BIOLOGICI·Filed 1984·Granted Sep 23, 1986·3 cites·2 claims
- 1727US5617295ALeadframe for supporting integrated semiconductor devicesST MICROELECTRONICS SRL·Filed 1995·Granted Apr 1, 1997·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →