Inventor · disambiguated record
Pai-Lee Chang
Also filed as: CHANG PAI-LEE
1 granted patent·1 pending application·0 citations·filing 2016–2017
5Inventor score
Files withTENNVAC INC2
Top patents by PatentIndex Score
2 records- 0138US10090575B2Method of manufacturing a waveguide assembly by adhesively bonding two waveguide units and a waveguide structure formed therefromTENNVAC INC·Filed 2017·Granted Oct 2, 2018·0 cites·10 claims
- 0214US2017202116A1Method for reducing gap in gasket fillingTENNVAC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →