Inventor · disambiguated record
Pao-Tung Chen
Also filed as: CHEN PAO-TUNG
40 granted patents·1 pending application·377 citations·filing 2009–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD32TAIWAN SEMICONDUCTOR MFG6CHUANG CHUN-CHIEH2CHEN SZU-YING1
Top patents by PatentIndex Score
41 records- 0198US9337235B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 10, 2016·227 cites·20 claims
- 0297US11545443B2Method for forming hybrid-bonding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·3 cites·20 claims
- 0396US9972603B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 15, 2018·19 cites·20 claims
- 0496US8878325B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 4, 2014·12 cites·20 claims
- 0596US8455971B2Apparatus and method for improving charge transfer in backside illuminated image sensorCHEN SZU-YING·Filed 2011·Granted Jun 4, 2013·35 cites·20 claims
- 0695US10777539B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·9 cites·20 claims
- 0792US9806119B23DIC seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·9 cites·20 claims
- 0891US9123617B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·4 cites·20 claims
- 0991US8981510B2Ridge structure for back side illuminated image sensorCHUANG CHUN-CHIEH·Filed 2010·Granted Mar 17, 2015·7 cites·20 claims
- 1090US8946784B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·8 cites·20 claims
- 1189US9530811B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·4 cites·20 claims
- 1288US2025311462A13dic seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1386US11600653B2Methods and apparatus for via last through-viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 7, 2023·3 cites·19 claims
- 1486US10475772B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·20 claims
- 1586US9287310B2Methods and apparatus for glass removal in CMOS image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 15, 2016·3 cites·19 claims
- 1685US11978758B2Methods and apparatus for via last through-viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·1 cites·20 claims
- 1785US11552027B2Semiconductor packaging device comprising a shield structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 10, 2023·1 cites·20 claims
- 1885US7968424B2Method of implantationTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jun 28, 2011·11 cites·20 claims
- 1984US10867891B2Ion through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 2083US10062721B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·20 claims
- 2182US9634053B2Image sensor chip sidewall interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 25, 2017·3 cites·19 claims
- 2281US10510792B23DIC seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·2 cites·20 claims
- 2381US10157895B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·2 cites·20 claims
- 2480US12396283B23DIC seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·18 claims
- 2579US10475843B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 12, 2019·2 cites·20 claims
- 2672US11037885B2Semiconductor packaging device comprising a shield structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·1 cites·20 claims
- 2772US10269863B2Methods and apparatus for via last through-viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Apr 23, 2019·2 cites·20 claims
- 2868US9780134B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·1 cites·20 claims
- 2966US11646247B2Ion through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 9, 2023·0 cites·20 claims
- 3065US11532661B23DIC seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
- 3164US10930699B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 3263US10510791B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 3361US9374538B2Image sensor with embedded infrared filter layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 21, 2016·0 cites·13 claims
- 3456US9929198B2Infrared image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 27, 2018·0 cites·20 claims
- 3555US10134794B2Image sensor chip sidewall interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·0 cites·20 claims
- 3654US9536915B2Image sensor with embedded infrared filter layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 3, 2017·0 cites·20 claims
- 3753US8293122B2Dual metal for a backside package of backside illuminated image sensorCHUANG CHUN-CHIEH·Filed 2009·Granted Oct 23, 2012·0 cites·19 claims
- 3852US9859322B2Methods and apparatus for glass removal in CMOS image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·0 cites·20 claims
- 3950US10790240B2Metal line design for hybrid-bonding applicationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 29, 2020·0 cites·20 claims
- 4049US9673246B2Dual metal for a backside package of backside illuminated image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 6, 2017·0 cites·20 claims
- 4147US9570503B2Ridge structure for back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →