Inventor · disambiguated record
Pai-Sheng Cheng
Also filed as: CHENG PAI S · CHENG PAI-SHENG
8 granted patents·8 pending applications·82 citations·filing 2004–2024
84Inventor score
Files withCHIPBOND TECHNOLOGY CORP4HIMAX TECH LTD3HIMAX TECH INC2WU CHIA-HUI2ADVANCED SEMICONDUCTOR ENG1
Top patents by PatentIndex Score
16 records- 0190US9105613B1Method of manufacturing electronic package module and electronic package module manufactured by the sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 11, 2015·23 cites·14 claims
- 0283US7064449B2Bonding pad and chip structureHIMAX TECH INC·Filed 2004·Granted Jun 20, 2006·41 cites·17 claims
- 0364US7906374B2COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereofHIMAX TECH LTD·Filed 2008·Granted Mar 15, 2011·3 cites·4 claims
- 0463US7061078B2Semiconductor packageHIMAX TECH INC·Filed 2004·Granted Jun 13, 2006·13 cites·22 claims
- 0562US2025239491A1Chip structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0662US2025239568A1Semiconductor package and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0761US7473459B2Method of manufacturing a film printed circuit boardHIMAX TECH LTD·Filed 2006·Granted Jan 6, 2009·2 cites·5 claims
- 0857US12317462B2Electronic package and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted May 27, 2025·0 cites·14 claims
- 0955US2024194646A1Semiconductor packageCHIPBOND TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1048US2009101513A1Method of manufacturing a film printed circuit boardWU CHIA-HUI·Filed 2008·Application pending·0 cites
- 1142US2009020316A1Method of manufacturing chip on film and structure thereofWU CHIA-HUI·Filed 2008·Application pending·0 cites
- 1240US2015214075A1Manufacturing method of selective electronic packaging deviceUNIVERSAL SCIENT IND SHANGHAI·Filed 2014·Application pending·0 cites
- 1338US8674503B2Circuit board, fabricating method thereof and package structureCHENG PAI-SHENG·Filed 2011·Granted Mar 18, 2014·0 cites·18 claims
- 1435US10777525B1Filp chip packageHIMAX TECH LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 1535US2006081968A1Semiconductor packageBAI SHWANG S·Filed 2004·Application pending·0 cites
- 1628US2005133912A1Electrical connection structureFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →